Exposure apparatus, exposure method, and method for producing device

ABSTRACT

A liquid immersion exposure apparatus includes a nozzle member having a recovery port and an opening via which an exposure beam passes. A projection system includes a first element closest to an image surface and a second element which is second closest to the image surface. The first element has a first surface facing the image surface, a second surface facing a lower surface of the second element, an inclined outer surface extending upwardly and radially outwardly from the first surface and facing an inner surface of the nozzle member, and a flange portion provided above the inclined outer surface. A support member supports the flange portion of the first element. A substrate stage has a holder for holding a substrate to be exposed and moves the substrate below and relative to the nozzle member and the projection system.

This is a Continuation of U.S. patent application Ser. No. 14/057,627filed Oct. 18, 2013, which is a Division of U.S. patent application Ser.No. 11/628,507 filed Dec. 5, 2006, which is the U.S. National Phase ofPCT/JP2005/010484 filed Jun. 8, 2005. The disclosure of each of theprior applications is hereby incorporated by reference herein in itsentirety.

TECHNICAL FIELD

The present invention relates to an exposure apparatus for exposing asubstrate through a liquid, an exposure method, and a method forproducing a device.

BACKGROUND ART

Semiconductor devices and liquid crystal display devices are produced bymeans of the so-called photolithography technique in which a patternformed on a mask is transferred onto a photosensitive substrate. Theexposure apparatus, which is used in the photolithography step, includesa mask stage for supporting the mask and a substrate stage forsupporting the substrate. The pattern on the mask is transferred ontothe substrate via a projection optical system while successively movingthe mask stage and the substrate stage. In recent years, it is demandedto realize the higher resolution of the projection optical system inorder to respond to the further advance of the higher integration of thedevice pattern. As the exposure wavelength to be used is shorter, theresolution of the projection optical system becomes higher. As thenumerical aperture of the projection optical system is larger, theresolution of the projection optical system becomes higher. Therefore,the exposure wavelength, which is used for the exposure apparatus, isshortened year by year, and the numerical aperture of the projectionoptical system is increased as well. The exposure wavelength, which isdominantly used at present, is 248 nm of the KrF excimer laser. However,the exposure wavelength of 193 nm of the ArF excimer laser, which isshorter than the above, is also practically used in some situations.When the exposure is performed, the depth of focus (DOF) is alsoimportant in the same manner as the resolution. The resolution R and thedepth of focus δ are represented by the following expressionsrespectively.

R=k ₁ ·λ/NA  (1)

δ=±k ₂ ·λ/NA ²  (2)

In the expressions, λ represents the exposure wavelength, NA representsthe numerical aperture of the projection optical system, and k₁ and k₂represent the process coefficients. According to the expressions (1) and(2), the following fact is appreciated. That is, when the exposurewavelength λ is shortened and the numerical aperture NA is increased inorder to enhance the resolution R, then the depth of focus δ isnarrowed.

If the depth of focus δ is too narrowed, it is difficult to match thesubstrate surface with respect to the image plane of the projectionoptical system. It is feared that the focus margin is insufficientduring the exposure operation. Accordingly, the liquid immersion methodhas been suggested, which is disclosed, for example, in InternationalPublication No. 99/49504 as a method for substantially shortening theexposure wavelength and widening the depth of focus. In this liquidimmersion method, the space between the lower surface of the projectionoptical system and the substrate surface is filled with a liquid such aswater or any organic solvent to form a liquid immersion area so that theresolution is improved and the depth of focus is magnified about n timesby utilizing the fact that the wavelength of the exposure light beam inthe liquid is 1/n as compared with that in the air (n represents therefractive index of the liquid, which is about 1.2 to 1.6 in ordinarycases).

In the case of the liquid immersion exposure apparatus as disclosed inInternational Publication No. 99/49504 described above, the liquid inthe liquid immersion area formed on the substrate makes contact with theoptical element which is arranged most closely to the image plane amonga plurality of elements (optical elements) for constructing theprojection optical system. In such a situation, the followingpossibility arises. That is, if the liquid in the liquid immersion areais mixed with any impurity or the like generated, for example, from thesurface of the substrate, and the liquid in the liquid immersion area iscontaminated therewith, then the optical element, which is arranged mostclosely to the image plane, may be polluted with the contaminated liquidin the liquid immersion area. If the optical element is polluted, anyinconvenience arises, for example, such that the light transmittance ofthe optical element is lowered and/or any distribution appears in thelight transmittance. As a result, there is such a possibility that theexposure accuracy and the measurement accuracy, which are obtained viathe projection optical system, are deteriorated.

A scanning type exposure apparatus, which exposes the substrate with thepattern formed on the mask while synchronously moving the mask and thesubstrate in the scanning direction, is also disclosed in InternationalPublication No. 99/49504 described above. In the case of the scanningtype exposure apparatus, it is required to realize the high speed forthe scanning velocity (scanning speed) in order to improve, for example,the productivity of the device. However, if the high scanning velocityis realized, the following possibility arises. That is, it is difficultto maintain the liquid immersion area to have a desired size.

DISCLOSURE OF THE INVENTION Problem to be Solved by the Invention

The present invention has been made taking the foregoing circumstancesinto consideration, an object of which is to provide an exposureapparatus with which it is possible to avoid the deterioration of theexposure accuracy and the measurement accuracy caused by the pollutionof the element (optical element), and a method for producing a deviceusing the exposure apparatus. Another object of the present invention isto provide an exposure apparatus and an exposure method in which theliquid immersion area is maintained to be in a desired state, and amethod for producing a device using the exposure apparatus.

Means for Solving the Problem and Effect of the Invention

In order to achieve the objects as described above, the presentinvention adopts the following constructions.

According to a first aspect of the present invention, there is providedan exposure apparatus which exposes a substrate by radiating an exposurelight beam onto the substrate through a liquid; the exposure apparatuscomprising a projection optical system which has a plurality of elementsincluding a first element closest to an image plane and a second elementwhich is second closest to the image plane with respect to the firstelement; wherein the first element has a first surface which is arrangedopposite to a surface of the substrate and through which the exposurelight beam passes, and a second surface which is arranged opposite tothe second element and through which the exposure light beam passes; thefirst element and the second element are supported in a substantiallystationary state with respect to an optical axis of the projectionoptical system; a space between the second element and the secondsurface of the first element is filled with a second liquid so that onlya partial area, which includes an area of the second surface of thefirst element through which the exposure light beam passes, serves as aliquid immersion area; and the exposure light beam is radiated onto thesubstrate to expose the substrate through a first liquid on a side ofthe first surface of the first element and the second liquid on a sideof the second surface.

According to the present invention, the space between the substrate andthe first surface of the first element is filled with the first liquid,and the space between the second element and the second surface of thefirst element is filled with the second liquid. Accordingly, thesubstrate can be exposed satisfactorily in a state in which the largeimage side numerical aperture of the projection optical system PL issecured. On the other hand, when the first liquid, which is on the sideof the first surface, makes contact with the substrate, there is such ahigh possibility that the side of the first surface of the first elementmay be polluted. However, the first element can be constructed to beeasily exchangeable, because each of the side of the first surface ofthe first element and the side of the second surface of the firstelement is filled with the liquid. Therefore, only the polluted firstelement can be exchanged with another clean element. The exposure andthe measurement can be performed satisfactorily via the liquids and theprojection optical system provided with the clean first element. Thesecond liquid locally forms the liquid immersion area in only thepartial area, including the area through which the exposure light beampasses, of the second surface of the first element. Accordingly, thesecond liquid can be prevented from any leakage from the circumferenceof the second surface of the first element. Therefore, it is possible toavoid the deterioration of any mechanical part or the like disposedaround the first element, which would be otherwise caused by the leakedsecond liquid. Further, it is possible to avoid the inflow of theliquid, for example, into the support section for supporting the firstelement, by locally forming the liquid immersion area of the secondliquid on the second surface of the first element. It is possible toavoid the deterioration of the support section. The second liquid makesno contact, for example, with the support section for supporting theelement, because the second liquid locally forms the liquid immersionarea on the second surface. Therefore, it is possible to avoid theinconvenience which would be otherwise caused, for example, such thatthe second liquid for forming the liquid immersion area is mixed withany impurity generated from the support section or the like. Therefore,the exposure process and the measurement process can be performedsatisfactorily in a state in which the cleanness of the second liquid ismaintained.

The first element, which is referred to in the present invention, may bea transparent member having no refractive power (for example, a parallelflat plate or plane parallel plate). For example, even when thetransparent member, which is arranged most closely to the image plane,does not contribute to the image formation performance of the projectionoptical system at all, the transparent member is regarded as the firstelement. The first element and the second element, which are referred toin the present invention, are supported in the substantially stationarystate with respect to the optical axis (exposure light beam) of theprojection optical system. However, even when at least one of the firstelement and the second element is supported finely movably in order toadjust the posture and the position thereof, it is regarded that theelement is “supported in the substantially stationary state”.

According to a second aspect of the present invention, there is providedan exposure apparatus which exposes a substrate by radiating an exposurelight beam onto the substrate through a liquid; the exposure apparatuscomprising a projection optical system which has a plurality of elementsincluding a first element closest to an image plane and a second elementwhich is second closest to the image plane with respect to the firstelement; wherein the first element has a first surface which is arrangedopposite to a surface of the substrate and through which the exposurelight beam passes, and a second surface which is arranged opposite tothe second element and through which the exposure light beam passes; anouter diameter of a surface of the second element opposed to the firstelement is smaller than an outer diameter of the second surface of thefirst element; the first element and the second element are supported ina substantially stationary state with respect to an optical axis of theprojection optical system; and the exposure light beam is radiated ontothe substrate to expose the substrate through a first liquid on a sideof the first surface of the first element and a second liquid on a sideof the second surface.

According to the present invention, the outer diameter of the opposingsurface of the second element opposed to the first element is smallerthan the outer diameter of the second surface of the first element.Accordingly, the liquid immersion area, which has the size correspondingto the surface of the second element, can be formed locally on thesecond surface of the first element, while covering the opposing surfacewith the second liquid. Therefore, the second liquid can be preventedfrom any leakage from the circumference of the second surface of thefirst element. It is possible to avoid the deterioration of anymechanical part or the like disposed around the first element, whichwould be otherwise caused by the leaked second liquid. Further, it ispossible to avoid the inflow of the liquid, for example, into thesupport section for supporting the first element, by locally forming theliquid immersion area of the second liquid on the second surface of thefirst element. It is possible to avoid the deterioration of the supportsection. The second liquid makes no contact, for example, with thesupport section for supporting the element, because the second liquidlocally forms the liquid immersion area on the second surface.Therefore, it is possible to avoid the inconvenience which would beotherwise caused, for example, such that the second liquid for formingthe liquid immersion area is mixed with any impurity generated from thesupport section or the like. Therefore, it is possible to maintain thecleanness of the second liquid. When the exposure light beam is radiatedonto the substrate via the second liquid of the liquid immersion areaformed locally on the second surface and the first liquid of the liquidimmersion area formed on the side of the first surface, the substratecan be exposed satisfactorily in the state in which the large image sidenumerical aperture of the projection optical system is secured. Each ofthe side of the first surface of the first element and the side of thesecond surface of the first element is filled with the liquid.Accordingly, the first element can be constructed to be easilyexchangeable. Therefore, only the polluted first element can beexchanged with another clean element. The exposure and the measurementcan be performed satisfactorily via the liquids and the projectionoptical system provided with the clean first element.

The first element, which is referred to in the present invention, may bea transparent member having no refractive power (for example, a parallelflat plate or plane parallel plate). For example, even when thetransparent member, which is arranged most closely to the image plane,does not contribute to the image formation performance of the projectionoptical system at all, the transparent member is regarded as the firstelement and as a part of the projection optical system. The firstelement and the second element, which are referred to in the presentinvention, are supported in the substantially stationary state withrespect to the optical axis (exposure light beam) of the projectionoptical system. However, even when at least one of the first element andthe second element is supported finely movably in order to adjust theposture and the position thereof, it is regarded that the element is“supported in the substantially stationary state”.

According to a third aspect of the present invention, there is providedan exposure apparatus which exposes a substrate by radiating an exposurelight beam onto the substrate through a first liquid; the exposureapparatus comprising a projection optical system which includes aplurality of elements and which has a first element closest to an imageplane and a second element which is second closest to the image planewith respect to the first element; and a first liquid immersionmechanism which supplies the first liquid; wherein the first element hasa first surface which is arranged opposite to a surface of the substrateand through which the exposure light beam passes, and a second surfacewhich is arranged opposite to the second element and which issubstantially in parallel to the first surface; an outer diameter of thesecond surface of the first element is greater than an outer diameter ofthe first surface of the first element; and the exposure light beam isradiated onto the substrate to expose the substrate through the firstliquid between the first element and the substrate.

According to the present invention, the outer diameter of the secondsurface of the first element is greater than the outer diameter of thefirst surface. Accordingly, when the first element is supported by asupport section, the support section, which supports the first element,can be provided at a position (end portion of the second surface) awayfrom the optical axis of the first element. Therefore, it is possible toavoid the interference between the support section and any member orequipment or the like arranged around the first element, and it ispossible to improve the degree of freedom of the design and the degreeof freedom of the arrangement of the member or the equipment or thelike. Further, it is possible to decrease the size of the liquidimmersion area formed between the first surface and the substrate by thefirst liquid immersion mechanism, because the outer diameter of thefirst surface of the first element is sufficiently smaller than that ofthe second surface.

The first element, which is referred to in the present invention, may bea transparent member having no refractive power (for example, a parallelflat plate or plane parallel plate). For example, even when thetransparent member, which is arranged most closely to the image plane,does not contribute to the image formation performance of the projectionoptical system at all, the transparent member is regarded as the firstelement and as a part of the projection optical system.

According to a fourth aspect of the present invention, there is providedan exposure apparatus which exposes a substrate by radiating an exposurelight beam onto the substrate through a first liquid; the exposureapparatus comprising a first liquid immersion mechanism which providesthe first liquid onto the substrate; and a projection optical systemwhich has a plurality of elements including a first element closest toan image plane and a second element which is second closest to the imageplane with respect to the first element; wherein the first element isarranged so that a first surface of the first element is opposed to asurface of the substrate, and a second surface of the first element isopposed to the second element; a distance between the first surface andthe second surface of the first element on an optical axis of theprojection optical system is not less than 15 mm; and the exposure lightbeam is radiated onto the substrate to expose the substrate through thefirst liquid on a side of the first surface of the first element.

According to the present invention, the distance between the firstsurface and the second surface of the first element, i.e., the thicknessof the first element is not less than 15 mm, and thus the first elementis thick. Therefore, the degree of freedom of the position is increasedfor the member and the equipment or the like arranged around the firstelement. Accordingly, it is possible to avoid the interference betweenthe support section and the member or equipment or the like arrangedaround the first element. As a result, it is possible to improve thedegree of freedom of the design of the member or the equipment or thelike. Accordingly, the support section, which supports the firstelement, can be provided at a position away from the optical axis of thefirst element. In particular, it is noted that the size of the liquidimmersion area of the first liquid can be decreased by improving thedegree of freedom of the design and the arrangement of the liquidimmersion mechanism for forming the liquid immersion area of the firstliquid. Further, the second liquid may be supplied also to the spacebetween the first element and the second element without being limitedto the first liquid supplied to the space between the first element andthe substrate. When the exposure light beam is radiated onto thesubstrate through the first liquid and the second liquid, the substratecan be exposed satisfactorily in the state in which the large image sidenumerical aperture of the projection optical system is secured. Thefirst element can be constructed to be easily exchangeable, because eachof the side of the first surface of the first element and the side ofthe second surface of the first element is filled with the liquid.Therefore, only the polluted first element can be exchanged with anotherclean element. The exposure and the measurement can be performedsatisfactorily via the liquid and the projection optical system providedwith the clean first element. When the first element is not less than 15mm, the change of the shape of the first element, which would beotherwise caused by the force received from the liquid, can besuppressed. Therefore, it is possible to maintain the high imageformation performance of the projection optical system.

The first element, which is referred to in the present invention, may bea transparent member having no refractive power (for example, a parallelflat plate or plane parallel plate). For example, even when thetransparent member, which is arranged most closely to the image plane,does not contribute to the image formation performance of the projectionoptical system at all, the transparent member is regarded as the firstelement and as a part of the projection optical system.

According to a fifth aspect of the present invention, there is providedan exposure apparatus which exposes a substrate by radiating an exposurelight beam onto the substrate through a first liquid; the exposureapparatus comprising a first liquid immersion mechanism which providesthe first liquid onto the substrate; and a projection optical systemwhich has a plurality of elements including a first element closest toan image plane and a second element which is second closest to the imageplane with respect to the first element; wherein the first element has afirst surface which is arranged opposite to a surface of the substrateand through which the exposure light beam passes, and a second surfacewhich is arranged opposite to the second element and through which theexposure light beam passes; a distance between the first surface and thesecond surface of the first element on an optical axis of the projectionoptical system is greater than a distance between the first surface ofthe first element and the surface of the substrate on the optical axisof the projection optical system; and the exposure light beam isradiated onto the substrate to expose the substrate through the firstliquid between the substrate and the first element and a second liquidbetween the second element and the first element.

According to the present invention, the substrate can be exposedsatisfactorily in a state in which the large image side numericalaperture of the projection optical system is secured, by radiating theexposure light beam onto the substrate through the first liquid and thesecond liquid. The first element is thick, and thus the support section,which supports the first element, can be provided at a position awayfrom the optical axis. The degree of freedom is increased, for example,for the arrangement of the member and the equipment arranged around thefirst element. Further, it is possible to suppress the change of theshape of the first element, which would be otherwise caused by the forcereceived from the liquid. Therefore, it is possible to maintain the highimage formation performance of the projection optical system.

According to a sixth aspect of the present invention, there is providedan exposure apparatus which exposes a substrate by radiating an exposurelight beam onto the substrate through a first liquid; the exposureapparatus comprising a first liquid immersion mechanism which providesthe first liquid onto the substrate to form a liquid immersion area ofthe first liquid on a part of the substrate; and a projection opticalsystem which has a plurality of elements including a first elementclosest to an image plane and a second element which is second closestto the image plane with respect to the first element; wherein the firstelement has a first surface which is arranged opposite to a surface ofthe substrate and through which the exposure light beam passes, and asecond surface which is arranged opposite to the second element andthrough which the exposure light beam passes; the first liquid immersionmechanism has a flat liquid contact surface which is arranged oppositeto the surface of the substrate, the liquid contact surface beingarranged to surround an optical path for the exposure light beam betweenthe substrate and the first surface of the first element; and theexposure light beam is radiated onto the substrate to expose thesubstrate through the first liquid between the substrate and the firstelement and the second liquid between the second element and the firstelement.

According to the present invention, the substrate can be exposedsatisfactorily in a state in which the large image side numericalaperture of the projection optical system is secured, by radiating theexposure light beam onto the substrate through the first liquid and thesecond liquid. The flat liquid contact surface is arranged opposite tothe surface of the substrate around the optical path for the exposurelight beam, between the first element and the substrate. Therefore, itis possible to continuously fill the optical path between the firstelement and the substrate with the first liquid.

According to a seventh aspect of the present invention, there isprovided an exposure method for exposing a substrate by radiating anexposure light beam onto the substrate via a liquid and a projectionoptical system including a first element closest to an image plane and asecond element which is second closest to the image plane with respectto the first element; wherein a first surface of the first element,which is opposed to the substrate, is smaller than a second surface ofthe first element which is opposed to the second element; and a surfaceof the second element, which is opposed to the first element, is smallerthan the second surface of the first element; the exposure methodcomprising providing a first liquid to a space between the substrate andthe first element; providing a second liquid to a space between thefirst element and the second element; and exposing the substrate byradiating the exposure light beam onto the substrate through the firstliquid and the second liquid. According to the exposure method of thepresent invention, the space between the first element and the secondelement can be reliably filled with the second liquid. The exposurelight beam is radiated onto the substrate through the first liquid andthe second liquid, and thus the substrate can be satisfactorily exposedin a state in which the large image side numerical aperture of theprojection optical system is secured.

According to still another aspect of the present invention, there isprovided a method for producing a device, comprising using the exposureapparatus or the exposure method described above. According to thepresent invention, it is possible to satisfactorily maintain theexposure accuracy and the measurement accuracy. Therefore, it ispossible to produce the device having the desired performance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic arrangement illustrating an exposure apparatusaccording to an embodiment of the present invention.

FIG. 2 shows a schematic perspective view illustrating those disposed inthe vicinity of a nozzle member.

FIG. 3 shows a perspective view illustrating the nozzle member as viewedfrom a lower position.

FIG. 4 shows a side sectional view illustrating those disposed in thevicinity of the nozzle member.

FIGS. 5(a) and 5(b) illustrate a second liquid immersion mechanism.

FIG. 6 shows a plan view illustrating a second surface of a firstelement.

FIG. 7 illustrates the operation for recovering the second liquid by thesecond liquid immersion mechanism.

FIGS. 8(a) and 8(b) schematically illustrate the operation forrecovering the liquid by a first liquid immersion mechanism according tothe present invention.

FIGS. 9(a) and 9(b) schematically show a comparative example of theoperation for recovering the liquid.

FIG. 10 schematically shows a modified embodiment of a first element.

FIG. 11 shows a perspective view illustrating a modified embodiment ofthe nozzle member as viewed from a lower position.

FIG. 12 shows a sectional view illustrating major parts to depictanother embodiment of the present invention.

FIG. 13 shows a sectional view illustrating major parts to depictanother embodiment of the present invention.

FIG. 14 shows a sectional view illustrating major parts to depictanother embodiment of the present invention.

FIG. 15 shows a flow chart illustrating exemplary steps of producing asemiconductor device.

FIG. 16 illustrates the operation for recovering the liquid by a firstliquid recovery mechanism in another embodiment of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be explained below with reference to thedrawings. However, the present invention is not limited thereto.

FIG. 1 shows a schematic arrangement illustrating an exposure apparatusaccording to an embodiment of the present invention. With reference toFIG. 1, the exposure apparatus EX includes a mask stage MST which ismovable while holding a mask M, a substrate stage PST which is movablewhile holding a substrate P, an illumination optical system IL whichilluminates, with an exposure light beam EL, the mask M held by the maskstage MST, a projection optical system PL which performs the projectionexposure for the substrate P held by the substrate stage PST with animage of a pattern of the mask M illuminated with the exposure lightbeam EL, and a control unit CONT which integrally controls the operationof the entire exposure apparatus EX.

The exposure apparatus EX of the embodiment of the present invention isa liquid immersion exposure apparatus to which the liquid immersionmethod is applied in order that the exposure wavelength is substantiallyshortened to improve the resolution and the depth of focus issubstantially widened. The exposure apparatus EX includes a first liquidimmersion mechanism 1 which fills, with the first liquid LQ1, the spacebetween the substrate P and a lower surface T1 of a first opticalelement LS1 closest to the image plane of the projection optical systemPL, among a plurality of optical elements LS1 to LS7 for constructingthe projection optical system PL. The substrate P is provided on theside of the image plane of the projection optical system PL. The lowersurface T1 of the first optical element LS1 is arranged opposite to thesurface of the substrate P. The first liquid immersion mechanism 1includes a first liquid supply mechanism 10 which supplies the firstliquid LQ1 to the space between the substrate P and the lower surface T1of the first optical element LS1, and a first liquid recovery mechanism20 which recovers the first liquid LQ1 supplied by the first liquidsupply mechanism 10. The operation of the first liquid immersionmechanism 1 is controlled by the control unit CONT.

The exposure apparatus EX includes a second liquid immersion mechanism 2which fills, with the second liquid LQ2, the space between the firstoptical element LS1 and the second optical element LS2 which is the nextclosest to the image plane of the projection optical system PL withrespect to the first optical element LS1. The second optical element LS2is arranged over (above) the first optical element LS1. That is, thesecond optical element LS2 is arranged on the side of the light-incidentsurface of the first optical element LS1. The upper surface T2 of thefirst optical element LS1 is arranged opposite to the lower surface T3of the second optical element LS2. The second liquid immersion mechanism2 includes a second liquid supply mechanism 30 which supplies the secondliquid LQ2 to the space between the first optical element LS1 and thesecond optical element LS2, and a second liquid recovery mechanism 40which recovers the second liquid LQ2 supplied by the second liquidsupply mechanism 30. The operation of the second liquid immersionmechanism 2 is controlled by the control unit CONT.

In this embodiment, the first optical element LS1 is a parallel flatplate having no refractive power through which the exposure light beamEL is transmissive. The lower surface T1 and the upper surface T2 of thefirst optical element LS1 are substantially in parallel to each other.The image formation characteristics including, for example, theaberration are set within predetermined allowable ranges for theprojection optical system PL including the first optical element LS1.

In this embodiment, the space (first space) K1 between the first opticalelement LS1 and the substrate P and the space (second space) K2 betweenthe first optical element LS1 and the second optical element LS2 arespaces which are independent from each other. The control unit CONT canindependently perform the supply operation and the recovery operationfor the first liquid LQ1 with respect to the first space K1 by the firstliquid immersion mechanism 1 and the supply operation and the recoveryoperation for the second liquid LQ2 with respect to the second space K2by the second liquid immersion mechanism 2. The liquid (LQ1, LQ2)neither comes in nor goes out from one to the other of the first spaceK1 and the second space K2.

The exposure apparatus EX is operated as follows at least during theperiod in which the image of the pattern of the mask M is projected ontothe substrate P. That is, the space between the first optical elementLS1 and the substrate P arranged on the image plane side thereof isfilled with the first liquid LQ1 by using the first liquid immersionmechanism 1 to form the first liquid immersion area LR1, and the spacebetween the first optical element LS1 and the second optical element LS2is filled with the second liquid LQ2 by using the second liquidimmersion mechanism 2 to form the second liquid immersion area LR2. Inthis embodiment, the exposure apparatus EX adopts the local liquidimmersion system wherein the first liquid immersion area LR1, which isgreater than the projection area AR and which is smaller than thesubstrate P, is locally formed on a part of the substrate P, the partincluding the projection area AR of the projection optical system PL. Inthis embodiment, the exposure apparatus EX locally forms the secondliquid immersion area LR2 of the second liquid LQ2 in only a partialarea, including the area AR′, of the upper surface T2 of the firstoptical element LS1 through which the exposure light beam EL passes. Theexposure apparatus EX performs the projection exposure for the substrateP with the pattern of the mask M such that the exposure light beam EL,which has passed through the mask M, is radiated onto the substrate Pvia the projection optical system PL, the second liquid LQ2 in thesecond liquid immersion area LR2, and the first liquid LQ1 in the firstliquid immersion area LR1.

A nozzle member 70, which will be described in detail later on, isarranged in the vicinity of the image plane of the projection opticalsystem PL, specifically in the vicinity of the optical element LS1disposed at the end on the image plane side of the projection opticalsystem PL. The nozzle member 70 is an annular member which is providedto surround the end portion of the projection optical system PL over(above) the substrate P (substrate stage PST). In this embodiment, thenozzle member 70 constructs a part of the first liquid immersionmechanism 1.

The embodiment of the present invention will be explained as exemplifiedby a case of the use of the scanning type exposure apparatus (so-calledscanning stepper) as the exposure apparatus EX in which the substrate Pis exposed with the pattern formed on the mask M while synchronouslymoving the mask M and the substrate P in mutually different directions(opposite directions) in the scanning directions. In the followingexplanation, the Z axis direction is the direction which is coincidentwith the optical axis AX of the projection optical system PL, the X axisdirection is the synchronous movement direction (scanning direction) forthe mask M and the substrate P in the plane perpendicular to the Z axisdirection, and the Y axis direction is the direction (non-scanningdirection) perpendicular to the Z axis direction and the X axisdirection. The directions of rotation (inclination) about the X axis,the Y axis, and the Z axis are designated as θX, θY, and θZ directionsrespectively.

The exposure apparatus EX includes a base BP which is provided on thefloor surface, and a main column 9 which is installed on the base BP.The main column 9 is formed with an upper step 7 and a lower step 8which protrude inwardly. The illumination optical system IL illuminates,with the exposure light beam EL, the mask M supported by the mask stageMST. The illumination optical system IL is supported by a support frame3 which is fixed to the upper portion of the main column 9.

The illumination optical system IL includes, for example, an exposurelight source which radiates the exposure light beam EL, an opticalintegrator which uniformizes the illuminance of the exposure light beamEL radiated from the exposure light source, a condenser lens whichcollects the exposure light beam EL emitted from the optical integrator,a relay lens system, and a variable field diaphragm which sets theillumination area on the mask M formed by the exposure light beam EL tobe slit-shaped. The predetermined illumination area on the mask M isilluminated with the exposure light beam EL having a uniform illuminancedistribution by the illumination optical system IL. Those usable as theexposure light beam EL radiated from the exposure light source include,for example, emission lines (g-ray, h-ray, i-ray) radiated, for example,from a mercury lamp, far ultraviolet light beams (DUV light beams) suchas the KrF excimer laser beam (wavelength: 248 nm), and vacuumultraviolet light beams (VUV light beams) such as the ArF excimer laserbeam (wavelength: 193 nm) and the F₂ laser beam (wavelength: 157 nm). Inthis embodiment, the ArF excimer laser beam is used.

In this embodiment, pure water is used for the first liquid LQ1 to besupplied from the first liquid supply mechanism 10 and the second liquidLQ2 to be supplied from the second liquid supply mechanism 30. That is,in this embodiment, the first liquid LQ1 and the second liquid LQ2 arethe same liquid. Those capable of being transmitted through pure waterare not limited to the ArF excimer laser beam, and also include theemission line (g-ray, h-ray, i-ray) radiated, for example, from amercury lamp and the far ultraviolet light beam (DUV light beam) such asthe KrF excimer laser beam (wavelength: 248 nm).

The mask stage MST is movable while holding the mask M. The mask stageMST holds the mask M by the vacuum attraction (or the electrostaticattraction). A plurality of gas bearings (air bearings) 85, which arenon-contact bearings, are provided on the lower surface of the maskstage MST. The mask stage MST is supported in a non-contact manner bythe air bearings 85 with respect to the upper surface (guide surface) ofa mask surface plate (mask base plate) 4. Openings MK1, MK2, throughwhich the image of the pattern of the mask M passes, are formed atcentral positions of the mask stage MST and the mask surface plate 4respectively. The mask surface plate 4 is supported by the upper step 7of the main column 9 via an anti-vibration unit 86. That is, in thisarrangement, the mask stage MST is supported by the main column 9 (upperstep 7) via the anti-vibration unit 86 and the mask surface plate 4. Themask surface plate 4 and the main column 9 are isolated from each otherin terms of the vibration by the anti-vibration unit 86 so that thevibration of the main column 9 is not transmitted to the mask surfaceplate 4 which supports the mask stage MST.

The mask stage MST is movable two-dimensionally in the planeperpendicular to the optical axis AX of the projection optical systemPL, i.e., in the XY plane, and it is finely rotatable in the θZdirection on the mask surface plate 4 in a state in which the mask M isheld in accordance with the driving of the mask stage-driving unit MSTDincluding a linear motor or the like controlled by the control unitCONT. The mask stage MST is movable at a designated scanning velocity inthe X axis direction. The mask stage MST has a movement stroke in the Xaxis direction to such an extent that the entire surface of the mask Mcan traverse at least the optical axis AX of the projection opticalsystem PL.

A movement mirror 81, which is movable together with the mask stage MST,is provided on the mask stage MST. A laser interferometer 82 is providedat a position opposed to the movement mirror 81. The position in thetwo-dimensional direction and the angle of rotation in the θZ direction(including the angles of rotation in the θX and θY directions in somecases) of the mask M on the mask stage MST are measured in real-time bythe laser interferometer 82. The result of the measurement performed bythe laser interferometer 82 is outputted to the control unit CONT. Thecontrol unit CONT drives the mask stage-driving unit MSTD on the basisof the result of the measurement obtained by the laser interferometer 82to thereby control the position of the mask M held by the mask stageMST.

The projection optical system PL projects the pattern on the mask M ontothe substrate P at a predetermined projection magnification β to performthe exposure. The projection optical system PL is constructed of theplurality of optical elements LS1 to LS7 including the first opticalelement LS1 which is provided at the end portion on the side of thesubstrate P. The plurality of optical elements LS1 to LS7 are supportedby the barrel PK. In this embodiment, the projection optical system PLis the reduction system in which the projection magnification β is, forexample, ¼, ⅕, or ⅛. The projection optical system PL may be any one ofthe 1× magnification system and the magnifying system. The projectionoptical system PL may be any one of the cata-dioptric system includingdioptric and catoptric elements, the dioptric system including nocatoptric element, and the catoptric system including no dioptricelement. The exposure light beam EL, which is radiated from theillumination optical system IL, comes into the projection optical systemPL from the side of the object plane, and the exposure light beam passesthrough the plurality of optical elements LS7 to LS1. After that, theexposure light beam EL outgoes from the side of the image plane of theprojection optical system PL, and the exposure light beam EL arrives atthe surface of the substrate P. Specifically, the exposure light beam ELpasses through the plurality of optical elements LS7 to LS3respectively, and then the exposure light beam EL passes through thepredetermined area of the upper surface T4 of the second optical elementLS2. Then, the exposure light beam EL passes through the predeterminedarea of the lower surface T3 of the second optical element LS2, and thenthe exposure light beam EL comes into the second liquid immersion areaLR2. The exposure light beam EL, which has passed through the secondliquid immersion area LR2, passes through the predetermined area of theupper surface T2 of the first optical element LS1, and then the exposurelight beam EL passes through the predetermined area of the lower surfaceT1 of the first optical element LS1. Then, the exposure light beam ELcomes into the first liquid immersion area LR1, and then the exposurelight beam EL arrives at the surface of the substrate P.

A flange PF is provided at the outer circumference of the barrel PKwhich holds the projection optical system PL. The projection opticalsystem PL is supported by a barrel surface plate (barrel base plate) 5via the flange PF. The barrel surface plate 5 is supported by the lowerstep 8 of the main column 9 via an anti-vibration unit 87. That is, inthis arrangement, the projection optical system PL is supported by themain column 9 (lower step 8) via the anti-vibration unit 87 and thebarrel surface plate 5. The barrel surface plate 5 and the main column 9are isolated from each other in terms of the vibration by theanti-vibration unit 87 so that the vibration of the main column 9 is nottransmitted to the barrel surface plate 5 which supports the projectionoptical system PL.

The substrate stage PST is movable while supporting a substrate holderPH which holds the substrate P. The substrate holder PH holds thesubstrate P by, for example, the vacuum attraction. A plurality of gasbearings (air bearings) 88, which are non-contact bearings, are providedon the lower surface of the substrate stage PST. The substrate stage PSTis supported in a non-contact manner with respect to the upper surface(guide surface) of a substrate surface plate (substrate base plate) 6 bythe air bearings 88. The substrate surface plate 6 is supported on thebase BP via an anti-vibration unit 89. The substrate surface plate 6,the main column 9, and the base BP (floor surface) are isolated from oneanother in terms of the vibration by the anti-vibration unit 89 so thatthe vibration of the base BP (floor surface) and/or the main column 9 isnot transmitted to the substrate surface plate 6 which supports thesubstrate stage PST.

The substrate stage PST is movable two-dimensionally in the XY plane,and it is finely rotatable in the θZ direction on the substrate surfaceplate 6 in a state in which the substrate P is held via the substrateholder PH in accordance with the driving of the substrate stage-drivingunit PSTD including, for example, a linear motor controlled by thecontrol unit CONT. Further, the substrate stage PST is also movable inthe Z axis direction, the θX direction, and the θY direction.

A movement mirror 83, which is movable together with the substrate stagePST with respect to the projection optical system PL, is provided on thesubstrate stage PST. A laser interferometer 84 is provided at a positionopposed to the movement mirror 83. The angle of rotation and theposition in the two-dimensional direction of the substrate P on thesubstrate stage PST are measured in real-time by the laserinterferometer 84. Although not shown, the exposure apparatus EX isprovided with a focus/leveling detecting system which detects theinformation about the position of the surface of the substrate Psupported by the substrate stage PST. Those adoptable as thefocus/leveling detecting system include, for example, the obliqueincidence system in which the detecting light beam is radiated in anoblique direction onto the surface of the substrate P, and the system inwhich the capacitance type sensor is used. The focus/leveling detectingsystem detects the information about the position in the Z axisdirection of the surface of the substrate P and the information aboutthe inclination in the θX and θY directions of the substrate P throughor not through the first liquid LQ1. In the case of the focus/levelingdetecting system which detects the surface information about the surfaceof the substrate P through or not through the liquid LQ1, the surfaceinformation about the surface of the substrate P may be detected at anyposition away from the projection optical system PL. An exposureapparatus, which detects the surface information about the surface ofthe substrate P at any position away from the projection optical systemPL, is disclosed, for example, in U.S. Pat. No. 6,674,510, contents ofwhich are incorporated herein by reference within a range of permissionof the domestic laws and ordinances of the state designated or selectedin this international application.

The result of the measurement performed by the laser interferometer 84is outputted to the control unit CONT. The result of the detectionperformed by the focus/leveling detecting system is also outputted tothe control unit CONT. The control unit CONT drives the substratestage-driving unit PSTD on the basis of the result of the detectionperformed by the focus/leveling detecting system to control the focusposition and the angle of inclination of the substrate P so that thesurface of the substrate P is adjusted to match the image plane of theprojection optical system PL. Further, the substrate P is subjected tothe position control in the X axis direction and the Y axis direction onthe basis of the result of the measurement performed by the laserinterferometer 84.

A recess 90 is provided on the substrate stage PST. The substrate holderPH for holding the substrate P is arranged in the recess 90. The uppersurface 91 of the substrate stage PST except for the recess 90 is a flatsurface (flat portion) which has substantially the same height as thatof (is flush with) the surface of the substrate P held by the substrateholder PH. In this embodiment, the upper surface of the movement mirror83 is also provided to be substantially flush with the upper surface 91of the substrate stage PST.

Substantially no difference in height appears outside the edge portionof the substrate P even when the edge area of the substrate P issubjected to the liquid immersion exposure, because the upper surface91, which is substantially flush with the surface of the substrate P, isprovided around the substrate P. Therefore, the liquid immersion areaLR1 can be satisfactorily formed by retaining the liquid LQ on the imageplane side of the projection optical system PL. It is also allowablethat any difference in height is present between the surface of thesubstrate P and the upper surface 91 of the substrate stage PST providedthat the liquid immersion area LR1 can be maintained. A gap of about 0.1to 2 mm is provided between the edge portion of the substrate P and theflat surface (upper surface) 91 provided around the substrate P.However, the liquid LQ scarcely flows into the gap owing to the surfacetension of the liquid LQ. Even when the exposure is performed for theportion in the vicinity of the circumferential edge of the substrate P,it is possible to retain the liquid LQ under the projection opticalsystem PL by the aid of the upper surface 91.

The first liquid supply mechanism 10 of the first liquid immersionmechanism 1 is provided to supply the first liquid LQ1 to the firstspace K1 between the substrate P and the first optical element LS1 ofthe projection optical system PL. The first liquid supply mechanism 10includes a first liquid supply section 11 which is capable of feedingthe first liquid LQ1, and a first supply tube 13 which has one endconnected to the first liquid supply section 11. The other end of thefirst supply tube 13 is connected to the nozzle member 70. In thisembodiment, the first liquid supply mechanism 10 supplies pure water.The first liquid supply section 11 includes, for example, a purewater-producing unit, and a temperature-adjusting unit which adjusts thetemperature of the first liquid (pure water) LQ1 to be supplied. It isalso allowable to use a pure water-producing unit (utility power orpower usage) of a factory in which the exposure apparatus EX isinstalled, instead of providing any pure water-producing unit for theexposure apparatus EX, provided that a predetermined quality conditionis satisfied. The operation of the first liquid supply mechanism 10(first liquid supply section 11) is controlled by the control unit CONT.In order to form the first liquid immersion area LR1 on the substrate P,the first liquid supply mechanism 10 supplies a predetermined amount ofthe first liquid LQ1 onto the substrate P arranged on the side of theimage plane of the projection optical system PL under the control of thecontrol unit CONT.

A flow rate controller 16 called “mass flow controller”, which controlsthe liquid amount per unit time to be fed from the first liquid supplysection 11 and supplied to the image plane side of the projectionoptical system PL, is provided at an intermediate position of the firstsupply tube 13. The control of the liquid supply amount by the flow ratecontroller 16 is performed in accordance with the instruction signalsupplied from the control unit CONT.

The first liquid recovery mechanism 20 of the first liquid immersionmechanism 1 recovers the first liquid LQ1 from the side of the imageplane of the projection optical system PL. The first liquid recoverymechanism 20 includes a first liquid recovery section 21 which iscapable of recovering the first liquid LQ1, and a first recovery tube 23which has one end connected to the first liquid recovery section 21. Theother end of the first recovery tube 23 is connected to the nozzlemember 70. The first liquid recovery section 21 includes, for example, avacuum system (suction unit) such as a vacuum pump, and a gas/liquidseparator which separates the recovered first liquid LQ1 from the gas.It is also allowable that all of the components including, for example,the vacuum system and the gas/liquid separator are not provided for theexposure apparatus EX but to use the equipment of a factory or the likein which the exposure apparatus EX is arranged, in place of at least apart or parts of the components as described above. The operation of thefirst liquid recovery mechanism 20 (first liquid recovery section 21) iscontrolled by the control unit CONT. In order to form the first liquidimmersion area LR1 on the substrate P, the first liquid recoverymechanism 20 recovers a predetermined amount of the first liquid LQ1from the surface of the substrate P supplied from the first liquidsupply mechanism 10 in accordance with the control of the control unitCONT.

The second liquid supply mechanism 30 of the second liquid immersionmechanism 2 supplies the second liquid LQ2 to the second space K2between the second optical element LS2 and the first optical element LS1of the projection optical system PL. The second liquid supply mechanism30 includes a second liquid supply section 31 which is capable offeeding the second liquid LQ2, and a second supply tube 33 which has oneend connected to the second liquid supply section 31. The other end ofthe second supply tube 33 is connected to the second space K2 disposedbetween the first optical element LS1 and the second optical elementLS2, for example, via the supply flow passage (34) as described lateron. The second liquid supply mechanism 30 supplies pure water in thesame manner as the first liquid supply mechanism 10. The second liquidsupply section 31 includes, for example, a pure water-producing unit,and a temperature-adjusting unit which adjusts the temperature of thesecond liquid (pure water) LQ2 to be supplied. It is also allowable touse a pure water-producing unit (utility power or power usage) of afactory in which the exposure apparatus EX is installed, instead ofproviding any pure water-producing unit for the exposure apparatus EX.The operation of the second liquid supply mechanism 30 (second liquidsupply section 31) is controlled by the control unit CONT. In order toform the second liquid immersion area LR2 on the upper surface T2 of thefirst optical element LS1, the second liquid supply mechanism 30supplies a predetermined amount of the second liquid LQ2 onto the uppersurface T2 of the first optical element LS1 in accordance with thecontrol of the control unit CONT.

The pure water-producing unit may be used commonly for both of the firstliquid immersion mechanism 1 and the second liquid immersion mechanism.

A mass flow controller, which controls the liquid amount per unit timefed from the second liquid supply section 31 and supplied to the secondspace K2, may be also provided at an intermediate position of the secondsupply tube 33.

The second liquid recovery mechanism 40 of the second liquid immersionmechanism 2 recovers the second liquid LQ2 from the second space K2disposed between the second optical element LS2 and the first opticalelement LS1 of the projection optical system PL. The second liquidrecovery mechanism 40 includes a second liquid recovery section 41 whichis capable of recovering the second liquid LQ2, and a second recoverytube 43 which has one end connected to the second liquid recoverysection 41. The other end of the second recovery tube 43 is connected tothe second space K2 disposed between the first optical element LS1 andthe second optical element LS2, for example, via the recovery flowpassage (44) as described later on. The second liquid recovery section41 includes, for example, a vacuum system (suction unit) such as avacuum pump, and a gas/liquid separator which separates the recoveredsecond liquid LQ2 from the gas. It is also allowable that all of thecomponents including, for example, the vacuum system and the gas/liquidseparator are not provided for the exposure apparatus EX, but to use theequipment (utility power or power usage) of a factory or the like inwhich the exposure apparatus EX is arranged, in place of at least a partor parts of the components as described above. The operation of thesecond liquid recovery mechanism 40 (second liquid recovery section 41)is controlled by the control unit CONT. The second liquid recoverymechanism 40 recovers the second liquid LQ2, from the upper surface T2of the first optical element LS1, supplied from the second liquid supplymechanism 30 in accordance with the control of the control unit CONT.

The nozzle member 70 is held by a nozzle holder 92, and the nozzleholder 92 is connected to the lower step 8 of the main column 9. Themain column 9, which supports the nozzle member 70 via the nozzle holder92, is isolated via the anti-vibration unit 87 in terms of thevibration, from the barrel surface plate 5 which supports the barrel PKof the projection optical system PL via the flange PF. Therefore, theprojection optical system PL is prevented from any transmission of thevibration generated by the nozzle member 70. Further, the main column 9,which supports the nozzle member 70 via the nozzle holder 92, isisolated via the anti-vibration unit 89 in terms of the vibration, fromthe substrate surface plate 6 which supports the substrate stage PST.Therefore, the substrate stage PST is prevented from any transmission ofthe vibration generated by the nozzle member 70 via the main column 9and the base BP. Further, the main column 9, which supports the nozzlemember 70 via the nozzle holder 92, is isolated via the anti-vibrationunit 86 in terms of the vibration, from the mask surface plate 4 whichsupports the mask stage MST. Therefore, the mask stage MST is preventedfrom any transmission of the vibration generated by the nozzle member 70via the main column 9.

Next, the first liquid immersion mechanism 1 and the nozzle member 70will be explained with reference to FIGS. 2, 3, and 4. FIG. 2 shows,with partial cutout, a schematic perspective view illustrating thosedisposed in the vicinity of the nozzle member 70. FIG. 3 shows aperspective view illustrating the nozzle member 70 as viewed from alower position. FIG. 4 shows a side sectional view.

The nozzle member 70 is arranged in the vicinity of the end portion onthe image plane side of the projection optical system PL. The nozzlemember 70 is an annular member which is provided to surround thecircumference of the projection optical system PL over the substrate P(substrate stage PST). In this embodiment, the nozzle member 70constructs a part of the first liquid immersion mechanism 1. The nozzlemember 70 has a hole 70H disposed at the central portion thereof inwhich the projection optical system PL can be arranged. As shown in FIG.4, the first optical element LS1 and the second optical element LS2 aresupported by the same barrel (support member) PK. In this embodiment, aninner side surface 70T of the hole 70H of the nozzle member 70 isprovided opposite to a side surface PKT of the barrel PK. A gap isprovided between the inner side surface 70T of the hole 70H of thenozzle member 70 and the side surface PKT of the barrel PK of theprojection optical system PL. The gap is provided in order to isolatethe projection optical system PL from the nozzle member 70 in terms ofthe vibration. Accordingly, the vibration, which is generated in thenozzle member 70, is prevented from being directly transmitted to theprojection optical system PL.

The inner side surface of the hole 70H of the nozzle member 70 islyophobic or liquid-repellent (water-repellent) with respect to theliquid LQ. This suppresses any inflow of the liquid LQ into the gapbetween the side surface of the projection optical system PL and theinner side surface of the nozzle member 70.

Those formed on the lower surface of the nozzle member 70 include aliquid supply port 12 for supplying the first liquid LQ1, and a liquidrecovery port 22 for recovering the first liquid LQ1. In the followingdescription, the liquid supply port 12 of the first liquid immersionmechanism 1 is appropriately referred to as “first supply port 12”, andthe liquid recovery port 22 of the first liquid immersion mechanism 1 isappropriately referred to as “first recovery port 22”.

Those formed in the nozzle member 70 include a first supply flow passage14 which is connected to the first supply port 12, and a first recoveryflow passage 24 which is connected to the first recovery port 22. Theother end of the first supply tube 13 is connected to the first supplyflow passage 14. The other end of the first recovery tube 23 isconnected to the first recovery flow passage 24. The first supply port12, the first supply flow passage 14, and the first supply tube 13construct parts of the first liquid supply mechanism 10 (first liquidimmersion mechanism 1). The first recovery port 22, the first recoveryflow passage 24, and the first recovery tube 23 construct parts of thefirst liquid recovery mechanism 20 (first liquid immersion mechanism 1).

The first supply port 12 is provided, over the substrate P supported bythe substrate stage PST, so as to oppose to the surface of the substrateP. The first supply port 12 is separated or away from the surface of thesubstrate P by a predetermined distance. The first supply port 12 isarranged to surround the projection area AR of the projection opticalsystem PL onto which the exposure light beam EL is radiated. In thisembodiment, the first supply port 12 is formed to have an annularslit-shaped configuration at the lower surface of the nozzle member 70to surround the projection area AR as shown in FIG. 3. In thisembodiment, the projection area AR is set to have a rectangular shape inwhich the Y axis direction (non-scanning direction) is the longitudinaldirection.

The first supply flow passage 14 is provided with a buffer flow passageportion 14H which has a portion connected to the other end of the firstsupply port 13, and an inclined flow passage portion 14S which has anupper end connected to the buffer flow passage portion 14H and which hasa lower end connected to the first supply port 12. The inclined flowpassage portion 14S has a shape corresponding to the first supply port12, and its cross section taken along the XY plane is formed to have anannular slit-shaped configuration to surround the first optical elementLS1. The inclined flow passage portion 14S has an angle of inclinationcorresponding to the side surface of the first optical element LS1arranged inside. As appreciated from FIG. 4, the inclined flow passageportion 14S is formed such that the spacing distance with respect to thesurface of the substrate P is increased at positions away farther fromthe optical axis AX of the projection optical system PL as viewed in aside sectional view.

The buffer flow passage portion 14H is a space which is provided outsideof the inclined flow passage portion 14S to surround the upper endportion of the inclined flow passage portion 14S and which is formed toexpand in the XY direction (horizontal direction). The inner side of thebuffer flow passage portion 14H (side on the optical axis AX) isconnected to the upper end of the inclined flow passage portion 14S. Theconnecting section thereof is an angular corner portion 17. A bankportion 15, which is formed to surround the upper end of the inclinedflow passage portion 14S, is provided in the vicinity of the connectingsection (angular corner section) 17, specifically in the inner area (onthe side of the optical axis AX) of the buffer flow passage portion 14H.The bank portion 15 is provided to protrude in the +Z direction from thebottom surface of the buffer flow passage portion 14H. A narrow flowpassage portion 14N, which is narrower than the buffer flow passageportion 14H, is defined between the bank portion 15 and the uppersurface (top plate portion 723 described later on) of the nozzle member.

In this embodiment, the nozzle member 70 is formed by combining a firstmember 71 and a second member 72. Each of the first and second members71, 72 can be formed of, for example, aluminum, titanium, stainlesssteel, duralumin, or any alloy containing at least two of them.

The first member 71 has a side plate portion 71A, a top plate portion71B which has its outer end connected at an upper predetermined positionof the side plate portion 71A, an inclined plate portion 71C which hasits upper end connected to an inner end of the top plate portion 71B,and a bottom plate portion 71D (see FIG. 3) which is connected to alower end of the inclined plate portion 71C. The respective plateportions are joined to one another and integrated as one body. Thesecond member 72 has a top plate portion 72B which has its outer endconnected to an upper end of the first member 71, an inclined plateportion 720 which has its upper end connected to an inner end of the topplate portion 723, and a bottom plate portion (plate portion) 72D whichis connected to a lower end of the inclined plate portion 72C. Therespective plate portions are joined to one another and integrated asone body. The bottom surface of the buffer flow passage portion 14H isformed by the top plate portion 71B of the first member 71. The ceilingsurface of the buffer flow passage portion 14H is formed by the lowersurface of the top plate portion 72B of the second member 72. The bottomsurface of the inclined flow passage portion 14S is formed by the uppersurface of the inclined plate portion 71C of the first member 71(surface directed in the direction toward the projection optical systemPL). The ceiling surface of the inclined flow passage portion 14S isformed by the lower surface of the inclined plate portion 72C of thesecond member 72 (surface directed in the direction opposite to theprojection optical system PL). Each of the inclined plate portion 710 ofthe first member 71 and the inclined plate portion 72C of the secondmember 72 is formed to be mortar-shaped. The slit-shaped supply flowpassage 14 is formed by combining the first and second members 71, 72.The outer portion of the buffer flow passage portion 14H is closed bythe upper area of the side plate portion 71A of the first member 71. Theupper surface of the inclined plate portion 72C of the second member 72(i.e., the inner side surface 70T of the nozzle member 70) is opposed tothe side surface PKT of the barrel PK of the projection optical systemPL.

The first recovery port 22 is provided so that the first recovery port22 is opposed to the surface of the substrate P over (above) thesubstrate P supported by the substrate stage PST. The first recoveryport 22 is away from the surface of the substrate P by predetermineddistances. The first recovery port 22 is provided outside the firstsupply port 12 separately farther from the projection area AR of theprojection optical system PL as compared with the first supply port 12.The first recovery port 22 is formed to surround the first supply port12 and the projection area AR onto which the exposure light beam EL isradiated. Specifically, a space 24, which is open downwardly, is formedby the side plate portion 71A, the top plate portion 71B, and theinclined plate portion 71C of the first member 71. The first recoveryport 22 is formed by the opening of the space 24. The first recoveryflow passage 24 is formed by the space 24. The other end of the firstrecovery tube 23 is connected to a part of the first recovery flowpassage (space) 24.

A porous member or perforated member 25, which has a plurality of pores,is arranged in the first recovery port 22 so that the first recoveryport 22 is covered therewith. The porous member 25 is formed of a meshmember having a plurality of pores. The porous member 25 can beconstructed, for example, with a mesh member formed with a honeycombpattern composed of a plurality of substantially hexagonal pores. Theporous member 25 is formed to be thin plate-shaped, which has, forexample, a thickness of about 100 μm.

The porous member 25 can be formed by performing a perforatingprocessing to a plate member which is to serve as a base member for theporous member formed of, for example, stainless steel (for example, SUS316). A plurality of thin plate-shaped porous members 25 can belaminated and arranged in the first recovery port 22 as well. The porousmember 25 may be subjected to a surface treatment to suppress theelution of any impurity to the first liquid LQ1 or a surface treatmentto enhance the lyophilic or liquid-attracting property. Such a surfacetreatment includes a treatment in which chromium oxide is adhered to theporous member 25, including, for example, the “GOLDEP WHITE” treatmentor the “GOLDEP” treatment provided by Kobelco Eco-Solutions Co., Ltd.When the surface treatment as described above is performed, it ispossible to avoid the inconvenience which would be otherwise caused, forexample, such that any impurity is eluted from the porous member 25 tothe first liquid LQ1. The surface treatment as described above may bealso performed to the nozzle member 70 (first and second members 71,72). The porous member 25 may be formed by using a material (forexample, titanium) with which any impurity is hardly eluted to the firstliquid LQ1.

The nozzle member 70 has a rectangular shape as viewed in a plan view.As shown in FIG. 3, the first recovery port 22 is formed to beframe-shaped (having a shape of “□” (polygon)) as viewed in a plan viewto surround the projection area AR and the first supply port 12 on thelower surface of the nozzle member 70. The thin plate-shaped porousmember 25 is arranged in the first recovery port 22. The bottom plateportion 71D of the first member 71 is arranged between the firstrecovery port 22 (porous member 25) and the first supply port 12. Thefirst supply port 12 is formed to be annular slit-shaped as viewed in aplan view between the bottom plate portion 71D of the first member 71and the bottom plate portion 72D of the second member 72.

The surfaces (lower surfaces) of the bottom plate portions 71D, 72D ofthe nozzle member 70, which are opposed to the substrate P respectively,are flat surfaces which are parallel to the XY plane. That is, thenozzle member 70 is provided with the bottom plate portions 71D, 72Dhaving the lower surfaces which are formed to be opposed to the surfaceof the substrate P (XY plane) supported by the substrate stage PST, andsubstantially in parallel to the surface of the substrate P. In thisembodiment, the lower surface of the bottom plate portion 71D issubstantially flush with the lower surface of the bottom plate portion72D. At this portion, the gap is the smallest with respect to thesurface of the substrate P placed on the substrate stage PST.Accordingly, the first liquid LQ1 can be satisfactorily retained betweenthe substrate P and the bottom surfaces of the bottom plate portions71D, 72D to form the first liquid immersion area LR1. In the followingdescription, the lower surfaces (flat portions) of the bottom plateportions 71D, 72D, which are formed to be opposed to the surface of thesubstrate P supported by the substrate stage PST, and substantially inparallel to the surface of the substrate P (XY plane), are appropriatelyreferred to as “land surface 75” in combination.

The land surface 75 is the surface which is included in the nozzlemember 70 and which is arranged at the position nearest to the substrateP supported by the substrate stage PST. In this embodiment, the lowersurface of the bottom plate portion 71D and the lower surface of thebottom plate portion 72D are collectively designated as the land surface75, because the lower surface of the bottom plate portion 71D issubstantially flush with the lower surface of the bottom plate portion72D. However, the porous member 25 may be also arranged on the lowersurface of the bottom plate portion 71D to provide a part of the firstrecovery port 22. In this arrangement, only the lower surface of thebottom plate portion 72D is the land surface 75.

The porous member 25 has a lower surface 26 which is opposed to thesubstrate P supported by the substrate stage PST. The porous member 25is provided in the first recovery port 22 so that the lower surface 26is inclined with respect to the surface of the substrate P supported bythe substrate stage PST (i.e., the XY plane). That is, the porous member25, which is provided in the first recovery port 22, has the inclinedsurface (lower surface) 26 which is opposed to the surface of thesubstrate P supported by the substrate stage PST. The first liquid LQ1is recovered via the inclined surface 26 of the porous member 25arranged in the first recovery port 22. That is, in this arrangement,the first recovery port 22 is formed on the inclined surface 26. Thefirst recovery port 22 is formed to surround the projection area AR ontowhich the exposure light beam EL is radiated. Therefore, in thisarrangement, the inclined surface 26 of the porous member 25 arranged inthe first recovery port 22 is formed to surround the projection area ARonto which the exposure light beam EL is radiated.

The inclined surface 26 of the porous member 25 opposed to the substrateP is formed such that the spacing distance with respect to the surfaceof the substrate P is increased at positions separated farther from theoptical axis AX of the projection optical system PL (exposure light beamEL). As shown in FIG. 3, the first recovery port 22 is formed to have ashape of “□” (polygon) as viewed in a plan view in this embodiment. Fourporous members 25A to 25D are combined and arranged in the firstrecovery port 22. In particular, the porous members 25A, 25C, which arearranged on the both sides in the X axis direction (scanning direction)with respect to the projection area AR respectively, are arranged sothat the spacing distances with respect to the surface of the substrateP are increased at positions separated farther from the optical axis AX,with the surfaces thereof crossing at right angles with respect to theXZ plane. The porous members 25B, 25D, which are arranged on the bothsides in the Y axis direction with respect to the projection area ARrespectively, are arranged so that the spacing distances with respect tothe surface of the substrate P are increased at positions separatedfarther from the optical axis AX, with the surfaces thereof crossing atright angles with respect to the YZ plane.

The lower surface of the bottom plate portion 71D connected to the lowerend of the inclined plate portion 71C of the first member 71 and thelower end of the side plate portion 71A are provided to haveapproximately the same position (height) in the Z axis direction. Theporous member 25 is attached to the first recovery port 22 of the nozzlemember 70 so that the inner edge of the inclined surface 26 hasapproximately the same height as that of the lower surface (land surface75) of the bottom plate portion 71D, and the inner edge of the inclinedsurface 26 is continuous to the lower surface (land surface 75) of thebottom plate portion 71D. That is, the land surface 75 is formedcontinuously to the inclined surface 26 of the porous member 25. Theporous member 25 is arranged so that the spacing distances are increasedwith respect to the surface of the substrate P at positions separatedfarther from the optical axis AX. A wall portion 76, which is formed bya partial area of the lower portion of the side plate portion 71A, isprovided outside the outer edge of the inclined surface 26 (porousmember 25). The wall portion 76 is provided at the circumferential edgeof the porous member 25 (inclined surface 26) to surround the porousmember 25. The wall portion 76 is provided outside the first recoveryport 22 with respect to the projection area AR in order to suppress theleakage of the first liquid LQ1.

A part of the bottom plate portion 72D for forming the land surface 75is arranged between the substrate P and the lower surface T1 of thefirst optical element LS1 of the projection optical system PL inrelation to the Z axis direction. That is, a part of the bottom plateportion 72D for forming the land surface 75 is provided under the lowersurface T1 of the optical element LS1 of the projection optical systemPL. An opening 74, through which the exposure light beam EL passes, isformed at a central portion of the bottom plate portion 72D which formsthe land surface 75. The opening 74 has a shape corresponding to theprojection area AR. In this embodiment, the opening 74 is formed to havean elliptical shape in which the Y axis direction (non-scanningdirection) is the longitudinal direction. The opening 74 is formed to belarger or greater than the projection area AR. The exposure light beamEL, which has passed through the projection optical system PL, canarrive at the surface of the substrate P without being blocked orshielded by the bottom plate portion 72D. That is, the bottom plateportion 72D, which forms the land surface 75, is arranged so that thebottom plate portion 72D is provided under the lower surface T1 of thefirst optical element LS1 to surround the optical path for the exposurelight beam EL at the position at which the optical path for the exposurelight beam EL is not disturbed. In other words, the land surface 75 isarranged to surround the projection area AR between the substrate P andthe lower surface T1 of the first optical element LS1. The bottom plateportion 72D is arranged opposite to the surface of the substrate P withthe lower surface thereof being the land surface 75. The bottom plateportion 72D is provided to make no contact with the substrate P and thelower surface T1 of the first optical element LS1. An edge portion 74Eof the opening 74 may be formed to be right-angled, acute-angled, orcircular arc-shaped.

In this arrangement, the land surface 75 is arranged between theprojection area AR onto which the exposure light beam EL is radiated andthe inclined surface 26 of the porous member 25 which is arranged in thefirst recovery port 22. In this arrangement, the first recovery port 22is arranged to surround the land surface 75 in the outside of the landsurface 75 with respect to the projection area AR. In this arrangement,the first supply port 12 is arranged outside the land surface 75 (bottomplate portion 72D) with respect to the projection area AR. In thisarrangement, the first supply port 12 is provided between the firstrecovery port 22 and the projection area AR of the projection opticalsystem PL. The first liquid LQ1 for forming the first liquid immersionarea LR1 is supplied, via the first supply port 12, between the firstrecovery port 22 and the projection area AR of the projection opticalsystem PL.

This embodiment adopts such an arrangement that the first recovery port22 is formed to have a shape of “□” (polygon) to surround the landsurface 75. However, the first recovery port 22 may be arranged suchthat the first recovery port 22 does not surround the land surface 75,provided that the first recovery port 22 is disposed outside the landsurface 75 with respect to the projection area AR. For example, thefirst recovery port 22 may be arranged in a divided manner inpredetermined areas, of the lower surface of the nozzle member 70, whichare disposed outside the land surface 75 on the both sides in thescanning direction (X axis direction) with respect to the projectionarea AR. Alternatively, the first recovery port 22 may be arranged in adivided manner in predetermined areas, of the lower surface of thenozzle member 70, which are disposed outside the land surface 75 on theboth sides in the non-scanning direction (Y axis direction) with respectto the projection area AR. On the other hand, when the first recoveryport 22 is arranged to surround the land surface 75, it is possible torecover the first liquid LQ1 via the first recovery port 22 morereliably.

As described above, the land surface 75 is arranged between thesubstrate P and the lower surface T1 of the first optical element LS1.The distance between the surface of the substrate P and the lowersurface T1 of the first optical element LS1 is longer than the distancebetween the land surface 75 and the surface of the substrate P. That is,the lower surface T1 of the first optical element LS1 is formed at theposition higher than that of the land surface 75 (to be far from thesubstrate P).

At least a part of the first recovery port 22 including the inclinedsurface 26 formed continuously to the land surface 75 is arrangedopposite to the surface of the substrate P between the substrate P andthe lower surface T1 of the first optical element LS1 in relation to theZ axis direction. That is, at least a part of the first recovery port 22is provided at the position lower than that of the lower surface T1 ofthe first optical element LS1 (to be near to the substrate P). In thisarrangement, the first recovery port 22 including the inclined surface26 is arranged around the lower surface T1 of the first optical elementLS1.

In this embodiment, the distance between the lower surface T1 of thefirst optical element LS1 and the upper surface T2 of the first opticalelement LS1 is about 4 mm. The distance between the substrate P and thelower surface T1 of the first optical element LS1, i.e., the thicknessof the liquid LQ1 in the optical path for the exposure light beam EL isabout 3 mm. The distance between the land surface 75 and the substrate Pis about 1 mm. The first liquid LQ1 of the first liquid immersion areaLR1 makes contact with the land surface 75. The first liquid LQ1 of thefirst liquid immersion area LR1 also makes contact with the lowersurface T1 of the first optical element LS1. That is, the land surface75 and the lower surface T1 of the first optical element LS1 serve asthe liquid contact surfaces to make contact with the first liquid LQ1 ofthe first liquid immersion area LR1.

The distance between the lower surface T1 of the first optical elementLS1 and the upper surface T2 of the first optical element LS1 is notlimited to 4 mm as described above, and can be set within a range of 3to 10 mm. The distance between the substrate P and the lower surface T1of the first optical element LS1 is not limited to 3 mm as describedabove, and can be set within a range of 1 to 5 mm, considering theabsorption of the exposure light beam EL by the liquid LQ1 and the flowof the liquid LQ1 in the first space K1. Further, the distance betweenthe land surface 75 and the substrate P is not limited to 1 mm asdescribed above as well, and can be set within a range of 0.5 to 1 mm.

The lower surface (liquid contact surface) T1 of the first opticalelement LS1 of the projection optical system PL has theliquid-attracting (hydrophilic) property. In this embodiment, theliquid-attracting treatment is performed to the lower surface T1. Thelower surface T1 of the first optical element LS1 is liquid-attractiveby the aid of the liquid-attracting treatment. The liquid-attractingtreatment is also performed to the land surface 75 to have theliquid-attracting property. The liquid-repelling treatment may beperformed to a part of the land surface 75 to have the liquid-repellingproperty.

The liquid-attracting treatment, which is applied in order to make apredetermined member such as the lower surface T1 of the first opticalelement LS1 to be liquid-attractive, includes, for example, a treatmentfor adhering a liquid-attracting material such as MgF₂, Al₂O₃, and SiO₂.Alternatively, as for the liquid-attracting treatment (water-attractingtreatment), the liquid-attracting property (hydrophilic property) can bealso performed, for example, by forming a thin film with a substancesuch as alcohol having a molecular structure with large polarityprovided with the OH group, because the liquid LQ is water having largepolarity in this embodiment. Further, when the first optical element LS1is formed of calcium fluorite or silica glass, it is possible to obtainthe satisfactory liquid-attracting property even when noliquid-attracting treatment is performed, because calcium fluorite orsilica glass has the high affinity for water. It is possible to allowthe first liquid LQ1 to make tight contact with the substantially entiresurface of the lower surface T1 of the first optical element LS1. A partof the land surface 75 (for example, the lower surface of the bottomplate portion 71D) may be liquid-repellent with respect to the firstliquid LQ1.

The liquid-repelling treatment, which is adopted in order to make a partof the land surface 75 to be liquid-repellent, includes, for example, atreatment to adhere a liquid-repelling material including, for example,fluorine-based materials such as polytetrafluoroethylene (Teflon (tradename)), acrylic resin materials, and silicon-based resin materials. Whenthe upper surface 91 of the substrate stage PST is made to beliquid-repellent, then it is possible to suppress the outflow of thefirst liquid LQ1 to the outside of the substrate P (outside of the uppersurface 91) during the liquid immersion exposure, it is possible tosmoothly recover the liquid LQ1 after the liquid immersion exposure aswell, and it is possible to avoid the inconvenience which would beotherwise caused such that the first liquid LQ1 remains on the uppersurface 91.

In order to supply the first liquid LQ1 onto the substrate P, thecontrol unit CONT drives the first liquid supply section 11 to feed thefirst liquid LQ1 from the first liquid supply section 11. The firstliquid LQ1, which is fed from the first liquid supply section 11, flowsthrough the first supply tube 13, and then the first liquid LQ1 flowsinto the buffer flow passage portion 14H of the first supply flowpassage 14 of the nozzle member 70. The buffer flow passage portion 14His the space which is expanded in the horizontal direction. The firstliquid LQ1, which has flown into the buffer flow passage portion 14H,flows to expand in the horizontal direction. The bank portion 15 isformed in the inner area (on the side of the optical axis AX) as thedownstream side of the flow passage of the buffer flow passage portion14H. Therefore, the first liquid LQ1 is expanded over the entire regionof the buffer flow passage portion 14H, and then the first liquid LQ1 isonce pooled. After the first liquid LQ1 is pooled in an amount not lessthan a predetermined amount in the buffer flow passage portion 14H(after the liquid level of the first liquid LQ1 is not less than theheight of the bank portion 15), the first liquid LQ1 flow into theinclined flow passage portion 14S via the narrow flow passage portion14N. The first liquid LQ1, which has flown into the inclined flowpassage portion 14S, flows downwardly along the inclined flow passageportion 14S. The first liquid LQ1 is supplied from the first supply port12 onto the substrate P arranged on the image plane side of theprojection optical system PL. The first supply port 12 supplies thefirst liquid LQ1 onto the substrate P from the position over thesubstrate P.

Owing to the provision of the bank portion 15 as described above, thefirst liquid LQ1, which has flown out from the buffer flow passageportion 14H, is supplied onto the substrate P substantially uniformlyfrom the entire region of the first supply port 12 formed annularly tosurround the projection area AR. That is, if the bank portion 15 (narrowflow passage portion 14N) is not formed, the flow rate of the firstliquid LQ1 allowed to flow through the inclined flow passage portion 14Sis greater in the area disposed in the vicinity of the connectingsection between the first supply tube 13 and the buffer flow passageportion 14H than in the other areas. Therefore, the liquid supply amountfor the surface of the substrate P is sometimes nonuniform at respectivepositions of the first supply port 12 which is formed annularly.However, the buffer flow passage portion 14H is formed to be providedwith the narrow flow passage portion 14N, and the liquid supply to thefirst supply port 12 is started after the first liquid LQ1 of the amountnot less than the predetermined amount is pooled in the buffer flowpassage portion 14H. Therefore, the first liquid LQ1 can be suppliedonto the substrate P in the state in which the flow rate distributionand the flow velocity distribution are uniformized at the respectivepositions of the first supply port 12. Any bubble tends to remain, forexample, upon the start of the supply in the vicinity of the angularcorner portion 17 of the first supply flow passage 14. However, thenarrow flow passage portion 14N is formed by narrowing the first supplyflow passage 14 in the vicinity of the angular corner portion 17.Accordingly, the high velocity is obtained for the flow rate of thefirst liquid LQ1 flowing through the narrow flow passage portion 14N.The bubble can be discharged to the outside of the first supply flowpassage 14 via the first supply port 12 in accordance with the flow ofthe first liquid LQ1 having the high velocity. When the liquid immersionexposure operation is executed after discharging the bubble, theexposure process can be performed in the state in which any bubble isabsent in the first liquid immersion area LR1. The bank portion 15 maybe provided to protrude in the −Z direction from the ceiling surface ofthe buffer flow passage portion 14H. In principle, it is enough that thenarrow flow passage portion 14N, which is narrower than the buffer flowpassage portion 14H, is provided on the downstream side of the flowpassage as compared with the buffer flow passage portion 14H.

The height of the bank portion 15 may be partially lowered (raised).When the bank portion 15 is provided with the area which partially hasany different height, the supply of the first liquid LQ1 from the firstsupply port 12 can be started at any partially different timing.Therefore, it is possible to avoid the remaining of the gas (bubble) inthe liquid for forming the liquid immersion area AR2 when the supply offirst liquid LQ1 is started. Alternatively, the buffer flow passageportion 14H may be divided into a plurality of flow passages tosuccessfully supply the liquid LQ in different amounts depending on thepositions of the slit-shaped liquid supply port 12.

In order to recover the liquid LQ1 from the surface of the substrate P,the control unit CONT drives the first liquid recovery section 21. Whenthe first liquid recovery section 21, which has the vacuum system, isdriven, the liquid LQ1, which is disposed on the substrate P, is allowedto flow into the first recovery flow passage 24 via the first recoveryport 22 arranged with the porous member 25. When the first liquid LQ1 inthe first liquid immersion area LR1 is recovered, the lower surface(inclined surface) 26 of the porous member 25 makes contact with thefirst liquid LQ1. The first recovery port 22 (porous member 25) isprovided over (above) the substrate P to oppose to the substrate P.Therefore, the first recovery port 22 (porous member 25) recovers thefirst liquid LQ1 from the surface of the substrate P from the positionthereover. The first liquid LQ1, which has flown into the first recoveryflow passage 24, flows through the first recovery tube 23, and then thefirst liquid LQ1 is recovered by the first liquid recovery section 21.

Next, the second liquid immersion mechanism 2 will be explained withreference to FIGS. 4, 5, 6, and 7.

With reference to FIG. 4, the first optical element LS1 and the secondoptical element LS2 are supported by the same barrel (support member)PK, and they are supported in the substantially stationary state withrespect to the optical path for the exposure light beam EL. The firstoptical element LS1 is supported by a first support section 91 which isprovided at the lower end of the barrel PK. The second optical elementLS2 is supported by a second support section 92 which is provided over(above) the first support section 91 in the barrel PK. A flange portionF2, which serves as a support objective portion, is provided at an upperportion of the second optical element LS2. The second support section 92supports the second optical element LS2 by supporting the flange portionF2. The first optical element LS1 is easily attachable/detachable withrespect to the first support section 91 of the barrel PK. That is, thefirst optical element LS1 is provided exchangeably. It is also allowablethat the first support section 91, which supports the first opticalelement LS1, may be attachable/detachable with respect to the secondsupport section 92, and the first support section 91 and the firstoptical element LS1 may be exchanged together.

The first optical element LS1 is a parallel flat plate, in which thelower surface T1 and the upper surface T2 are in parallel to oneanother. The lower surface T1 and the upper surface T2 are substantiallyin parallel to the XY plane. The surface of the substrate P supported bythe substrate stage PST is substantially in parallel to the XY plane.Therefore, the lower surface T1 and the upper surface T2 aresubstantially in parallel to the surface of the substrate P supported bythe substrate stage PST. The lower surface T1 of the first opticalelement LS1 supported by the first support section 91 is substantiallyflush with the lower surface PKA of the barrel PK. The bottom plateportion 72D, which forms the land surface 75, extends under the lowersurface T1 of the first optical element LS1 and the lower surface PKA ofthe barrel PK.

The lower surface T3 of the second optical element LS2 is formed to beflat surface-shaped. The lower surface T3 of the second optical elementLS2 supported by the second support section 92 is substantially inparallel to the upper surface T2 of the first optical element LS1supported by the first support section 91. On the other hand, the uppersurface T4 of the second optical element LS2 is formed to be convextoward the object plane (toward the mask M), and has a positiverefractive power. Accordingly, the reflection loss of the light beam(exposure light beam EL) allowed to come into the upper surface T4 isreduced. Consequently, the large image side numerical aperture of theprojection optical system PL is secured. The second optical element LS2,which has the refractive power (lens function), is supported by thesecond support section 92 of the barrel PK in the state of beingpositioned satisfactorily.

In this embodiment, the outer diameter D3 of the lower surface T3 of thesecond optical element LS2 opposed to the first optical element LS1 isformed to be smaller than the outer diameter D2 of the upper surface T2of the first optical element LS1.

As described above, the exposure light beam EL passes through therespective predetermined areas of the upper surface T4 and the lowersurface T3 of the second optical element LS2. Further, the exposurelight beam EL passes through the respective predetermined areas of theupper surface T2 and the lower surface T1 of the first optical elementLS1.

For example, the connecting portion between the barrel PK and the firstoptical element LS1 is sealed. That is, the first space K1 disposed onthe side of the lower surface T1 of the first optical element LS1 andthe second space K2 disposed on the side of the upper surface T2 of thefirst optical element LS1 are the spaces which are independent from eachother. The flow of the liquid is prohibited between the first space K1and the second space K2. As described above, the first space K1 is thespace between the first optical element LS1 and the substrate P. Thefirst liquid immersion area LR1 of the first liquid LQ1 is formed in thefirst space K1. On the other hand, the second space K2 is a part of theinternal space of the barrel PK. The second space K2 is the spacedisposed between the upper surface T2 of the first optical element LS1and the lower surface T3 of the second optical element LS2 arrangedthereover. The second liquid immersion area LR2 of the second liquid LQ2is formed in the second space K2. A gap is provided between the sidesurface C2 of the second optical element LS2 and the inner side surfacePKC of the barrel PK.

As shown in FIG. 4, the other end of a second supply tube 33 isconnected to one end of a second supply flow passage 34 formed in thebarrel PK. On the other hand, the other end of the second supply flowpassage 34 of the barrel PK is connected to a supply member 35 arrangedinside (in the internal space of) the barrel PK. The supply member 35,which is arranged inside the barrel PK, has a liquid supply port 32 forsupplying the second liquid LQ2 to the second space K2. A supply flowpassage 36, through which the second liquid LQ2 flows, is formed in thesupply member 35. The connecting portion of the second supply flowpassage 34 with respect to the supply member 35 (supply flow passage 36)is provided in the vicinity of the second space K2 on the inner sidesurface PKC of the barrel PK.

The other end of the second recovery tube 43 is connected to one end ofa second recovery flow passage 44 formed in the barrel PK. On the otherhand, the other end of the second recovery flow passage 44 of the barrelPK is connected to a recovery member 45 arranged inside (in the internalspace of) the barrel PK. The recovery member 45, which is arrangedinside the barrel PK, has liquid recovery ports 42 for recovering thesecond liquid LQ2 from the second space K2. A recovery flow passage 46,through which the second liquid LQ2 flows, is formed in the recoverymember 45. The connecting portion of the second recovery flow passage 44with respect to the recovery member 45 (recovery flow passage 46) isprovided in the vicinity of the second space K2 on the inner sidesurface PKC of the barrel PK.

The liquid supply port 32, the supply member 35 (supply flow passage36), the second supply flow passage 34, and the second supply tube 33construct a part of the second liquid supply mechanism 30 (second liquidimmersion mechanism 2). The liquid recovery ports 42, the recoverymember 45 (recovery flow passage 46), the second recovery flow passage44, and the second recovery tube 43 construct a part of the secondliquid recovery mechanism 40 (second liquid immersion mechanism 2). Inthe following description, the liquid supply port 32 of the secondliquid immersion mechanism 2 is appropriately referred to as “secondsupply port 32”, and the liquid recovery port 42 of the second liquidimmersion mechanism 2 is appropriately referred to as “second recoveryport 42”.

FIG. 5 illustrates the second liquid immersion mechanism 2 for formingthe second liquid immersion area LR2, wherein FIG. 5(a) shows a sideview, and FIG. 5(b) shows a view taken along a line A-A shown in FIG.5(a). As shown in FIG. 5, the supply member 35 is constructed of ashaft-shaped member extending in the horizontal direction. In thisembodiment, the supply member 35 is arranged on the +X side of thepredetermined area AR′ of the upper surface T2 of the first opticalelement LS1 through which exposure light beam EL passes. The supplymember 35 is provided to extend in the X axis direction. One end of thesupply flow passage 36 formed in the supply member 35 is connected tothe other end of the second supply flow passage 34 (see FIG. 4) formedin the barrel PK. The other end of the supply flow passage 36 isconnected to the second supply port 32. The second supply port 32 isformed so that the second supply port 32 is directed toward the −X side.The second supply port 32 discharges the second liquid LQ2 substantiallyin parallel to the upper surface T2 of the first optical element LS1,i.e., substantially in parallel to the XY plane (in the lateraldirection). The second supply port 32 of the second liquid immersionmechanism 2 is arranged in the second space K2. Therefore, the secondliquid supply section 31 is connected to the second space K2, forexample, via the second supply tube 33, the second supply flow passage34, and the second supply port 32.

Gaps are provided between the supply member 35 and the upper surface T2of the first optical element LS1 and between the supply member 35 andthe lower surface T3 of the second optical element LS2 respectively.That is, the supply member 35 is supported by the barrel PK or apredetermined support mechanism so that the supply member 35 is in anon-contact state with respect to the first optical element LS1 and thesecond optical element LS2 respectively. Accordingly, the vibration,which is generated in the supply member 35, is prevented from beingdirectly transmitted to the first and second optical elements LS1, LS2.When the supply member 35 is allowed to be in the non-contact state withrespect to the first optical element LS1 and the second optical elementLS2 respectively, it is possible to suppress the change of the shape ofeach of the first optical element LS1 and the second optical elementLS2. Thus, it is possible to maintain the high image formationperformance of the projection optical system PL.

The supply member 35 is provided at the position at which the radiationof the exposure light beam EL is not disturbed, i.e., outside thepredetermined area AR′ of the upper surface T2 of the first opticalelement LS1 through which the exposure light beam EL passes. The secondsupply port 32 is arranged at the predetermined position between thepredetermined area AR′ and the edge portion of the upper surface T2 ofthe first optical element LS1 in the second space K2.

When the control unit CONT is operated to feed the second liquid LQ2from the second liquid supply section 31 of the second liquid supplymechanism 30 in order to form the second liquid immersion area LR2, thenthe second liquid LQ2, which is fed from the second liquid supplysection 31, flows through the second supply tube 33, and then the secondliquid LQ2 flows into one end of the second supply flow passage 34formed in the barrel PK. The liquid LQ2, which has flown into one end ofthe second supply flow passage 34, flows through the second supply flowpassage 34, and then the liquid LQ2 flows into one end of the supplyflow passage 36 of the supply member 35 connected to the other endthereof. The second liquid LQ2, which has flown into one end of thesupply flow passage 36, flows through the supply flow passage 36, andthen the second liquid LQ2 is supplied to the second space K2 via thesecond supply port 32. The second liquid LQ2, which has been suppliedfrom the second supply port 32, locally forms the second liquidimmersion area LR2 in only a partial area of the upper surface T2 of thefirst optical element LS1, the partial area being smaller than the uppersurface T2 and the partial area being greater than the predeterminedarea AR′ through which the exposure light beam EL passes. The secondliquid LQ2, which has been supplied to the space between the firstoptical element LS1 and the second optical element LS2, is retained bythe surface tension between the upper surface T2 of the first opticalelement LS1 and the lower surface T3 of the second optical element LS2.The second liquid LQ2 in the second liquid immersion area LR2 makescontact with the partial area of the upper surface T2 of the firstoptical element LS1, and the second liquid LQ2 makes contact with thesubstantially entire surface of the lower surface T3 of the secondoptical element LS2. As described above, the outer diameter D3 of thelower surface T3 of the second optical element LS2 is smaller than theouter diameter D2 of the upper surface T2 of the first optical elementLS1. Therefore, the second liquid LQ2, with which the space between thefirst optical element LS1 and the second optical element LS2 is filled,can form the second liquid immersion area LR2 which is smaller than theupper surface T2 of the first optical element LS1, below the lowersurface T3 of the second optical element LS2 (above the upper surface T2of the first optical element LS1).

In this embodiment, the distance between the upper surface T2 of thefirst optical element LS1 and the lower surface T3 of the second opticalelement LS2, i.e., the thickness of the liquid LQ2 in the optical pathfor the exposure light beam EL is about 3 mm. However, the distancebetween the upper surface T2 of the first optical element LS1 and thelower surface T3 of the second optical element LS2 is not limited to 3mm as described above, and can be set within a range of 0.5 to 5 mmconsidering the absorption of the exposure light beam EL by the liquidLQ2 and the flow of the liquid LQ2 in the second space K2.

As shown in FIG. 6, the surface of the first area HR1, which is thepartial area to serve as the second liquid immersion area LR2 and whichis included in the upper surface T2 of the first optical element LS1facing the second space K2, has the affinity for the second liquid LQ2,the affinity being higher than the affinity for the second liquid LQ2 ofthe surface of the second area HR2 as the area around the first areaHR1. That is, the contact angle of the surface of the first area HR1with respect to the second liquid LQ2 is smaller than the contact angleof the surface of the second area HR2 with respect to the second liquidLQ2. Specifically, the surface of the second area HR2 isliquid-repellent with respect to the second liquid LQ2. Accordingly,when the second liquid immersion area LR2 of the second liquid LQ2 isformed in the partial area (first area HR1) of the upper surface T2 ofthe first optical element LS1, it is possible to avoid the inconveniencewhich would be otherwise caused such that the second liquid LQ2 outflowsto the outside of the upper surface T2. The first area HR1 includes thepredetermined area AR′ through which the exposure light beam EL passes.When the surface of the first area HR1 including the predetermined areaAR′ is liquid-attractive, the second liquid LQ2 can be allowed to maketight contact with the surface of the first area HR1 satisfactorily.

In this embodiment, the liquid-repelling property is applied to thesurface of the second area HR2 by performing the liquid-repellingtreatment to the surface of the second area HR2. The liquid-repellingtreatment, which is adopted in order to allow the surface of the secondarea HR2 to be liquid-repellent, includes, for example, a treatment tocoat a liquid-repelling material including, for example, fluorine-basedmaterials such as polytetrafluoroethylene, acrylic resin materials, andsilicon-based resin materials, and a treatment to stuck a thin filmformed of the liquid-repelling material as described above. In thisembodiment, the surface of the second area HR2 is coated with “CYTOP”produced by Asahi Glass Co., Ltd.

In this embodiment, at least the first and second optical elements LS1,LS2, which make contact with the first and second liquids LQ1, LQ2 andwhich are included in the plurality of optical elements LS1 to LS7, areformed of silica glass. Silica glass has the high affinity for the firstand second liquids LQ1, LQ2 as water. Accordingly, it is possible toallow the first and second liquids LQ1, LQ2 to make tight contact withthe substantially entire regions of the first area HR1 of the uppersurface T2 and the lower surface T1 as the liquid contact surfaces ofthe first optical element LS1 and the lower surface T3 as the liquidcontact surface of the second optical element LS2. Therefore, it ispossible to allow the first and second liquids LQ1, LQ2 to make tightcontact with the liquid contact surfaces of the first and second opticalelements LS1, LS2 to reliably fill the optical path between the secondoptical element LS2 and the first optical element LS1 with the secondliquid LQ2 and reliably fill the optical path between the first opticalelement LS1 and the substrate P with the first liquid LQ1.

Silica glass is a material having the large refractive index. Therefore,for example, the size of the second optical element LS2 can bedecreased. It is possible to realize compact sizes of the entireprojection optical system PL and the entire exposure apparatus EX.Further, silica glass is water-resistant. Therefore, an advantage isobtained, for example, such that it is unnecessary to provide anyprotective film for the liquid contact surface.

At least one of the first and second optical elements LS1, LS2 may becalcium fluorite having the high affinity for water. For example, theoptical elements LS3 to LS7 may be formed of calcium fluorite, and theoptical elements LS1, LS2 may be formed of silica glass. All of theoptical elements LS1 to LS7 may be formed of silica glass (or calciumfluorite).

The water-attracting (liquid-attracting) treatment, in which aliquid-attracting material such as MgF₂, Al₂O₃, and SiO₂ is adhered, maybe performed to the liquid contact surfaces of the first and secondoptical elements LS1, LS2 including the first area HR1 of the uppersurface T2 of the first optical element LS1 to further enhance theaffinity for the first and second liquids LQ1, LQ2. Alternatively, asfor the liquid-attracting treatment (water-attracting treatment), thehydrophilic property can be also applied to the liquid contact surfacesof the optical elements LS1, LS2, for example, by forming a thin filmwith a substance such as alcohol having a molecular structure with largepolarity, because the first and second liquids LQ1, LQ2 are water havinglarge polarity in this embodiment.

In this arrangement, the second area HR2, which is disposed around thefirst area HR1 including the predetermined area AR′ of the upper surfaceT2 of the first optical element LS1 through which the exposure lightbeam EL passes, is liquid-repellent. However, it is also allowable thatan area, which is disposed around a partial area including apredetermined area of the lower surface T3 of the second optical elementLS2 through which the exposure light beam EL passes, may beliquid-repellent.

With reference to FIG. 5(b) again, the recovery member 45 includes ashaft portion 45A, and an annular portion 45B which is connected to theshaft portion 45A. The shaft portion 45A is provided to extend in thehorizontal direction. In this embodiment, the shaft portion 45A isarranged on the −X side in relation to the predetermined area AR′, andthe shaft portion 45A is provided to extend in the X axis direction. Theannular portion 45B is formed to be smaller than the edge portion of theupper surface T2 of the first optical element LS1, and a part of theannular portion 45B on the −X side is connected to the shaft portion45A. On the other hand, a part of the annular portion 45B on the +X sideis open or discontinuous, and the supply member 35 is arranged at anopening 45K.

The recovery flow passage 46, which corresponds to the shape of therecovery member 45, is formed in the recovery member 45. One end of therecovery flow passage 46, which is formed in the shaft portion 45A ofthe recovery member 45, is connected to the other end of the secondrecovery flow passage 44 (see FIG. 4) formed in the barrel PK. Theannular recovery flow passage 46 is formed in the annular portion 45B ofthe recovery member 45 to surround the predetermined area AR′. The otherend of the recovery flow passage 46 formed in the shaft portion 45A isconnected to a part of the annular recovery flow passage 46 formed inthe annular portion 45B.

The second recovery ports 42 are formed on the inner side surface of theannular portion 45B directed to the predetermined area AR′. The secondrecovery ports 42 are provided to recover the second liquid LQ2 from thesecond space K2. The plurality of second recovery ports 42 are providedon the inner side surface of the annular portion 45B to surround thesecond liquid immersion area LR2 formed on the upper surface T2 of thefirst optical element LS1. The plurality of second recovery ports 42,which are provided on the inner side surface of the annular portion 45B,are connected to the recovery flow passage 46 formed in the annularportion 45B. The second recovery ports 42 of the second liquid immersionmechanism 2 are arranged in the second space K2. Therefore, in thisarrangement, the second liquid recovery section 41 is connected to thesecond space K2, via the second recovery tube 43, the second recoveryflow passage 44, and the second recovery ports 42 or the like.

The recovery member 45 (annular portion 45B) is provided outside thepredetermined area AR′ at the position at which the radiation of theexposure light beam EL is not disturbed, i.e., at the position tosurround the predetermined area AR′ of the upper surface T2 of the firstoptical element LS1 through which the exposure light beam EL passes. Thesecond recovery ports 42 are arranged at the predetermined positionsbetween the predetermined area AR′ and the edge portion of the uppersurface T2 in the second space K2.

Gaps are provided between the recovery member 45 and the upper surfaceT2 of the first optical element LS1 and between the recovery member 45and the lower surface T3 of the second optical element LS2 respectively.That is, the recovery member 45 is supported by the barrel PK or apredetermined support mechanism so that the recovery member 45 is in thenon-contact state with respect to the first optical element LS1 and thesecond optical element LS2 respectively. Accordingly, the vibration,which is generated in the recovery member 45, is prevented from beingdirectly transmitted to the first and second optical elements LS1, LS2.

When the second liquid LQ2 of the second liquid immersion area LR2 isrecovered, the control unit CONT drives the second liquid recoverysection 41 of the second liquid recovery mechanism 40. When the secondliquid recovery section 41 having the vacuum system is driven, thesecond liquid LQ2 of the second liquid immersion area LR2 flows into therecovery flow passage 46 formed in the annular portion 45B of therecovery member 45 via the second recovery ports 42. The second recoveryports 42 are arranged to surround the second liquid immersion area LR2.Therefore, the second liquid LQ2 of the second liquid immersion area LR2is recovered from the surrounding thereof via the second recovery ports42. It is desirable that a porous member is also arranged for the secondrecovery ports 42 to suppress the vibration generated when the secondliquid LQ2 is recovered.

As shown in FIG. 6, a protruding area HRT, which protrudes inwardly(toward the predetermined area AR′), is provided for the second area HR2having the liquid-repelling property of the upper surface T2 of thefirst optical element LS1. In this embodiment, the protruding area HRTis provided at the position corresponding to the opening 45K of theannular portion 45B of the recovery member 45. Accordingly, when thesecond liquid LQ2 is recovered via the second recovery ports 42 from thesurrounding of the second liquid immersion area LR2 in a state in whichthe supply of the second liquid LQ2 from the second supply port 32 isstopped, the second liquid LQ2 of the second liquid immersion area LR2is recovered via the second recovery ports 42 arranged around the secondliquid immersion area LR2 so that the second liquid LQ2 is divided atthe protruding area HRT as a base point, as schematically shown in FIG.7. In this way, it is possible to avoid the inconvenience which would beotherwise caused, for example, such that the second liquid LQ2 isunsuccessfully recovered and the second liquid LQ2 remains, for example,at a central portion of the first area HR1. Therefore, it is possible toavoid the occurrence of the inconvenience resulting from the remainingsecond liquid LQ2, which would be otherwise caused, for example, suchthat the remaining second liquid LQ2 is vaporized, and any adhesiontrace (so-called water mark) is formed on the upper surface T2.

In this embodiment, the protruding area HRT is provided at the positioncorresponding to the opening 45K of the annular portion 45B of therecovery member 45. However, the protruding area HRT may be provided atany position other than the position corresponding to the opening 45K.The protruding area HRT shown in the drawing is substantiallyrectangular as viewed in a plan view. However, it is possible to adoptany arbitrary shape including, for example, triangular and semicircularshapes.

The second liquid LQ2, which has flown into the recovery flow passage 46formed in the annular portion 45B, is collected in the recovery flowpassage 46 formed in the shaft portion 45A, and then the second liquidLQ2 flows into the second recovery flow passage 44 formed in the barrelPK. The second liquid LQ2, which has flown through the second recoveryflow passage 44, is sucked and recovered by the second liquid recoverysection 41 via the second recovery tube 43.

Next, an explanation will be made about a method for exposing thesubstrate P with the image of the pattern of the mask M by using theexposure apparatus EX constructed as described above.

When the exposure is performed for the substrate P, the control unitCONT supplies the second liquid LQ2 from the second liquid supplymechanism 30 to the second space K2. When the second liquid supplymechanism 30 supplies the second liquid LQ2, the space between thesecond optical element LS2 and the upper surface T2 of the first opticalelement LS1 is filled with the second liquid LQ2 so that only thepartial area of the upper surface T2 of the first optical element LS1,which includes the predetermined area AR′ through which the exposurelight beam EL passes, becomes the second liquid immersion area LR2. Thesecond liquid LQ2, which is supplied from the second liquid supplymechanism 30, locally forms the second liquid immersion area LR2 whichis greater than the predetermined area AR′ and which is smaller than theupper surface T2, on a part of the upper surface T2 including thepredetermined area AR′. After the second liquid immersion area LR2 isformed, the control unit CONT stops the supply of the second liquid LQ2by the second liquid supply mechanism 30. The second liquid LQ2 betweenthe first optical element LS1 and the second optical element LS2 isretained by the surface tension, and the second liquid immersion areaLR2 is maintained.

After the substrate P is loaded on the substrate stage PST at a loadposition, the substrate stage PST, which holds the substrate P, is movedby the control unit CONT to the position under the projection opticalsystem PL, i.e., the exposure position. The control unit CONT suppliesand recovers the first liquid LQ1 by using the first liquid supplymechanism 10 and the first liquid recovery mechanism 20 while optimallycontrolling the supply amount of the first liquid LQ1 per unit timebrought about by the first liquid supply mechanism 10 and the recoveryamount of the first liquid LQ1 per unit time brought about by the firstliquid recovery mechanism 20 in the state in which the substrate stagePST is opposed to the first optical element LS1 of the projectionoptical system PL. And the control unit CONT forms the first liquidimmersion area LR1 of the first liquid LQ1 on at least the optical pathfor the exposure light beam EL included in the first space K1, and fillsthe optical path for the exposure light beam EL with the first liquidLQ1.

In this arrangement, reference members (measuring members), which areprovided with reference marks to be measured, for example, by asubstrate alignment system as disclosed in Japanese Patent ApplicationLaid-open No. 4-65603 and a mask alignment system as disclosed inJapanese Patent Application Laid-open No. 7-176468, are provided atpredetermined positions on the substrate stage PST. Further, forexample, an uneven illuminance sensor as disclosed, for example, inJapanese Patent Application Laid-open No. 57-117238, a spatialimage-measuring sensor as disclosed, for example, in Japanese PatentApplication Laid-open No. 2002-14005, and a radiation amount sensor(illuminance sensor) as disclosed, for example, in Japanese PatentApplication Laid-open No. 11-16816 are provided as optical measuringsections at predetermined positions on the substrate stage PST. Beforethe exposure process is performed for the substrate P, the control unitCONT performs the measurement of the marks on the reference membersand/or various types of measuring operations by using the opticalmeasuring sections. The control unit CONT performs the alignment processfor the substrate P and the process for adjusting (calibrating) theimage formation characteristic of the projection optical system PL onthe basis of the measurement results. For example, when the measuringoperation by using the optical measuring section is performed, thecontrol unit CONT moves the substrate stage PST relative to the firstliquid immersion area LR1 of the first liquid LQ1 by moving thesubstrate stage PST in the XY directions to arrange the first liquidimmersion area LR1 of the first liquid LQ1 on the optical measuringsection so that the measuring operation is performed in this state viathe first liquid LQ1 and the second liquid LQ2. The measurement of thereference mark measured by the mask alignment system and/or the varioustypes of the calibration processes using the optical measuring sectionsmay be performed before the substrate P as the exposure objective isplaced on the substrate stage PST.

After the alignment process and the calibration process are performed asdescribed above, the control unit CONT projects the image of the patternof the mask M onto the substrate P to expose the substrate P therewithby radiating the exposure light beam EL onto the substrate P via theprojection optical system PL, the second liquid LQ2 of the second liquidimmersion area LR2 formed on the side of the upper surface T2 of thefirst optical element LS1, and the first liquid LQ1 of the first liquidimmersion area LR1 formed on the side of the lower surface T1 of thefirst optical element LS1, while moving, in the X axis direction(scanning direction), the substrate stage PST which supports thesubstrate P, and while performing the recovery of the first liquid LQ1from the surface of the substrate P by using the first liquid recoverymechanism 20 concurrently with the supply of the first liquid LQ1 ontothe substrate P by using the first liquid supply mechanism 10. The firstliquid LQ1, which is supplied from the first liquid supply mechanism 10,locally forms the first liquid immersion area LR1 which is greater thanthe projection area AR and which is smaller than the substrate P, on thepart of the substrate P including the projection area AR. The secondliquid LQ2, which is supplied from the second liquid supply mechanism30, locally forms the second liquid immersion area LR2 which is greaterthan the predetermined area AR′ and which is smaller than the uppersurface T2, on the part of the upper surface T2 including thepredetermined area AR′ of the upper surface T2 of the first opticalelement LS1.

During the exposure of the substrate P, the operation for supplying thefirst liquid LQ1 and the operation for recovering the first liquid LQ1are continued by the first liquid immersion mechanism 1. The opticalpath for the exposure light beam EL between the first element and thesubstrate P is filled with the first liquid LQ1, while maintaining thesize and the shape of the first liquid immersion area LR1 to be in adesired state. On the other hand, during the exposure of the substrateP, the operation for supplying the second liquid LQ2 and the operationfor recovering the second liquid LQ2 are not performed by the secondliquid immersion mechanism 2. That is, the exposure is performed throughthe second liquid LQ2 in the pooled state (retained state by the surfacetension) in the second space K2. When the supply and the recovery of thesecond liquid LQ2 are not performed during the exposure of the substrateP, no vibration is generated by the supply and/or the recovery of thesecond liquid LQ2 during the exposure of the substrate P. Therefore, itis possible to avoid the deterioration of the exposure accuracy whichwould be otherwise caused by the vibration.

The second liquid LQ2 locally forms the second liquid immersion area LR2in only the partial area including the predetermined area AR′ throughwhich the exposure light beam EL passes, of the upper surface T2 of thefirst optical element LS1. Accordingly, it is possible to avoid theleakage of the second liquid LQ2 to the outside of the upper surface T2of the first optical element LS1. Therefore, it is possible to avoid theinflow and the adhesion of the second liquid LQ2 with respect to thebarrel PK (first support section 91) for supporting the first opticalelement LS1. It is possible to avoid the deterioration of the barrel PK(first support section 91). Further, it is possible to avoid thedeterioration of any mechanical part and any electric part disposedaround the first optical element LS1, which would be otherwise caused bythe leaked second liquid LQ2.

The second liquid LQ2 makes no contact, for example, with the barrel PKand/or the first support section 91, because the second liquid LQ2locally forms the second liquid immersion area LR2 on the upper surfaceT2 of the first optical element LS1. Therefore, it is possible to avoidthe inconvenience such as the mixing of any impurity including the metalion or the like generated, for example, from the barrel PK and the firstsupport section 91 with respect to the second liquid LQ2 for forming thesecond liquid immersion area LR2. Therefore, the exposure process andthe measurement process can be satisfactorily performed in the state inwhich the cleanness of the second liquid LQ2 is maintained.

The exposure apparatus EX of this embodiment performs the projectionexposure onto the substrate P with the image of the pattern of the maskM while moving the mask M and the substrate P in the X axis direction(scanning direction). During the scanning exposure, a part of the imageof the pattern of the mask M is projected into the projection area ARvia the projection optical system PL and the first and second liquidsLQ1, LQ2 of the first and second liquid immersion areas LR1, LR2. Themask M is moved at the velocity V in the −X direction (or in the +Xdirection), in synchronization with which the substrate P is moved atthe velocity β·V (β represents the projection magnification) in the +Xdirection (or in the −X direction) with respect to the projection areaAR. A plurality of shot areas are set on the substrate P. After theexposure is completed for one shot area, the next shot area is moved tothe scanning start position in accordance with the stepping movement ofthe substrate P. The scanning exposure process is successively performedthereafter for the respective shot areas while moving the substrate P inthe step-and-scan manner.

In this embodiment, the first optical element LS1, which is formed ofthe parallel flat plate, is arranged under the second optical elementLS2 having the lens function. However, the first space K1 disposed onthe side of the lower surface T1 of the first optical element LS1 andthe second space K2 of the first optical element LS1 disposed on theside of the upper surface T2 are filled with the first liquid LQ1 andthe second liquid LQ2 respectively. Accordingly, the reflection loss isreduced on the lower surface T3 of the second optical element LS2 andthe upper surface T2 of the first optical element LS1. The substrate Pcan be exposed satisfactorily in the state in which the large image sidenumerical aperture of the projection optical system PL is secured.

In this embodiment, the porous member 25 is inclined with respect to thesurface of the substrate P. In this arrangement, the first liquid LQ1 isrecovered via the inclined surface 26 of the porous member 25 arrangedin the first recovery port 22. In this arrangement, the first liquid LQ1is recovered via the first recovery port 22 including the inclinedsurface 26. Further, the land surface 75 and the inclined surface 26 areformed continuously. In such a situation, when the substrate P issubjected to the scanning movement at a predetermined velocity by apredetermined distance in the +X direction with respect to the firstliquid immersion area LR1 from the initial state shown in FIG. 8(a) (thestate in which the first liquid immersion area LR1 of the first liquidLQ1 is formed between the land surface 75 and the substrate P), thestate as shown in FIG. 8(b) is obtained. The component F1 to moveobliquely in the upward direction along the inclined surface 26 and thecomponent F2 to move in the horizontal direction are generated in thefirst liquid LQ1 of the first liquid immersion area LR1 in thepredetermined state after the scanning movement as shown in FIG. 8(b).In this situation, the shape of the interface (gas/liquid interface) LGbetween the first liquid LQ1 of the first liquid immersion area LR1 andthe space disposed outside is maintained. Even when the substrate P ismoved at a high velocity with respect to the first liquid immersion areaLR1, it is possible to suppress any great change of the shape of theinterface LG.

The distance between the inclined surface 26 and the substrate P isgreater than the distance between the land surface 75 and the substrateP. That is, the space between the inclined surface 26 and the substrateP is greater than the space between the land surface 75 and thesubstrate P. Therefore, when the substrate P is moved with respect tothe first liquid immersion area LR1, it is possible to make a distance Lbetween an interface LG′ and the interface LG to be relatively small,the interface LG′ being brought about in the initial state shown in FIG.8(a) and the interface LG being brought about in the predetermined stateafter the scanning movement shown in FIG. 8(b). Therefore, it ispossible to decrease the size of the first liquid immersion area LR1.

For example, as shown in FIG. 9(a), even if the land surface 75 and alower surface 26′ of the porous member 25 arranged in the first recoveryport 22 are formed continuously, the lower surface 26′ of the porousmember 25 is not inclined with respect to the substrate P, and the lowersurface 26′ of the porous member 25 is substantially in parallel to thesurface of the substrate P, in other words, even if the first recoveryport 22 including the lower surface 26′ is not inclined, then the shapeof the interface LG is maintained when the substrate P is moved withrespect to the first liquid immersion area LR1. However, only thecomponent F2 to move in the horizontal direction is generated in thefirst liquid LQ1, and the component (F1) to move in the upward directionis hardly generated, because the lower surface 26′ is not inclined. Insuch a situation, the interface LG is moved by approximately the samedistance as the movement amount of the substrate P. Therefore, thedistance L between the interface LG′ in the initial state and theinterface LG in the predetermined state after the scanning movement hasa relatively great value. Accordingly, the first liquid immersion areaLR1 is increased in size as well. On this assumption, it is necessarythat the nozzle member 70 should be large-sized as well corresponding tothe large first liquid immersion area LR1. Further, it is also requiredto increase the movement stroke of the substrate stage PST and the sizeof the substrate stage PST itself according to the size of the firstliquid immersion area LR1. Consequently, the entire exposure apparatusEX becomes huge in size. The tendency to increase the size of the firstliquid immersion area LR1 is conspicuous as the scanning velocity of thesubstrate P with respect to the first liquid immersion area LR1 ishighly increased.

As shown in FIG. 9(b), when the distance between the lower surface 26′and the substrate P is made greater than the distance between the landsurface 75 and the substrate P by providing the difference in heightbetween the land surface 75 and the first recovery port 22 (lowersurface 26′ of the porous member 25), in other words, when the spacebetween the lower surface 26′ and the substrate P is made greater thanthe space between the land surface 75 and the substrate P, then thecomponent F1′ to move in the upward direction is generated in the firstliquid LQ1. Therefore, it is possible to make the distance L to have arelatively small value, and it is possible to suppress the large size ofthe first liquid immersion area LR1. However, the shape of the interfaceLG tends to be collapsed, because the difference in height is providedbetween the land surface 75 and the lower surface 26′, and the landsurface 75 and the lower surface 26′ are not formed continuously. Whenthe shape of the interface LG is collapsed, there is such a highpossibility that any inconvenience may be caused, in which the gas ismixed into the first liquid LQ1 of the first liquid immersion area LR1,and any bubble is generated in the first liquid LQ1. For example, whenthe substrate P is scanned at a high velocity in the +X direction, thenthe presence of the difference in height causes the collapse of theshape of the interface LG, and the component F1′ to move in the upwarddirection is further increased. As a result, the thickness is thinnedfor the first liquid LQ1 in the area disposed at the position mostdeviated toward the +X side of the first liquid immersion area LR1. Whenthe substrate P is moved in the −X direction (subjected to the reversescanning) in this state, there is such a high possibility that aphenomenon arises to break the first liquid LQ1 into portions. If thebroken liquid (see the symbol LQ′ in FIG. 9(b)) remains, for example, onthe substrate P, an inconvenience arises such that any adhesion trace(so-called water mark) is formed on the substrate P due to thevaporization of the liquid LQ′. When the shape of the interface LG iscollapsed, then the first liquid LQ1 outflows to the outside of thesubstrate P, and there is such a high possibility to cause anyinconvenience including, for example, the rust and/or the electricleakage in relation to the peripheral members and the equipment as well.The possibility of the occurrence of the inconvenience as describedabove is increased as the scanning velocity is highly increased for thesubstrate P with respect to the first liquid immersion area LR1.

In this embodiment, the first recovery port 22 of the first liquidimmersion mechanism 1 (first liquid recovery mechanism 20) is formed onthe inclined surface 26 opposed to the surface of the substrate P.Therefore, even when the substrate P and the first liquid immersion areaLR1 formed on the image plane side of the projection optical system PLare relatively moved, then it is possible to maintain the shape of theinterface LG between the first liquid LQ1 of the first liquid immersionarea LR1 and the space disposed outside, and it is possible to maintainthe desired state for the shape of the first liquid immersion area LR1.Therefore, it is possible to avoid the inconvenience which would beotherwise caused, for example, such that any bubble is generated in thefirst liquid LQ1, the liquid cannot be recovered sufficiently, and theliquid outflows. When the first recovery port 22 is provided on theinclined surface 26, it is possible to suppress the movement amount ofthe interface LG. Accordingly, it is possible to decrease the size ofthe first liquid immersion area LR1. Therefore, it is also possible torealize the compact size of the entire exposure apparatus EX.

When the substrate P is scanned at a high velocity, there is such a highpossibility that the first liquid LQ1 of the first liquid immersion areaLR1 outflows to the outside and/or the first liquid LQ1 of the firstliquid immersion area LR1 is scattered to the surroundings. However, itis possible to suppress the leakage of the first liquid LQ1, because thewall portion 76 is provided at the circumferential edge of the inclinedsurface 26. That is, when the wall portion 76 is provided at thecircumferential edge of the porous member 25, the buffer space is formedinside the wall portion 76. Therefore, even when the liquid LQ arrivesat the inner side surface of the wall portion 76, the liquid LQ, whichforms the liquid immersion area AR2, is expanded in the buffer spacedisposed inside the wall portion 76. Accordingly, it is possible to morereliably avoid the leakage of the liquid LQ to the outside of the wallportion 76.

The part of the land surface 75 (lower surface of the bottom plateportion 72D) is arranged under the end surface T1 of the projectionoptical system PL to surround the projection area AR1. Therefore, thesmall gap, which is formed between the part of the land surface 75(lower surface of the bottom plate portion 72D) and the surface of thesubstrate P, is formed in the vicinity of the projection area tosurround the projection area. Accordingly, it is possible tocontinuously maintain the small liquid immersion area which is necessaryand sufficient to cover the projection area AR1. Therefore, it ispossible to realize the compact size of the entire exposure apparatusEX, while suppressing the inconvenience including, for example, theoutflow of the liquid LQ and the mixing of the gas into the liquid LQ ofthe liquid immersion area AR2, even when the substrate P is moved(scanned) at a high velocity. Further, the liquid supply port 12 isarranged outside the part of the land surface 75 (lower surface of thebottom plate portion 72D). Therefore, it is possible to prevent the gas(bubble) from mixing into the liquid LQ which forms the liquid immersionarea AR2. Even when the substrate P is moved at a high velocity, it ispossible to continuously fill the optical path for the exposure lightbeam EL with the liquid.

In the embodiment described above, the inclined surface 26 is formed byattaching the thin plate-shaped porous member 25 obliquely with respectto the substrate P. Alternatively, an inclined surface may be providedon the lower surface of the nozzle member 70 so that the spacingdistance with respect to the surface of the substrate P is increased atpositions separated farther from the optical axis AX of the exposurelight beam EL, and the liquid recovery port 22 may be formed at apredetermined position (in a predetermined area) of the inclinedsurface. The porous member 25 may be provided for the liquid recoveryport 22.

In this embodiment, the porous member 25 is arranged in the firstrecovery port 22. However, it is also allowable that the porous member25 is absent or omitted. Also in this case, for example, an inclinedsurface may be provided on the lower surface of the nozzle member 70 sothat the spacing distance with respect to the surface of the substrate Pis increased at positions separated farther from the optical axis AX ofthe exposure light beam EL, and the liquid recovery port may be providedat a predetermined position of the inclined surface. Accordingly, it ispossible to maintain the shape of the interface LG, and it is possibleto avoid the inconvenience which would be otherwise caused, for example,such that any bubble is generated in the first liquid LQ1 of the firstliquid immersion area LR1. Further, it is also possible to decrease thesize of the first liquid immersion area LR1.

When the exposure for the substrate P is completed, then the controlunit CONT stops the supply of the first liquid LQ1 having been performedby the first liquid supply mechanism 10, and the first liquid LQ1 in thefirst liquid immersion area LR1 (first liquid LQ1 in the first space K1)is recovered by using, for example, the first liquid recovery mechanism20. Further, the control unit CONT recovers the first liquid LQ1remaining on the substrate P and on the substrate stage PST, by using,for example, the first recovery port 22 of the first liquid recoverymechanism 20.

As explained with reference to FIG. 7, the control unit CONT recovers,via the second recovery ports 42, the second liquid LQ2 in the secondliquid immersion area LR2 formed in the second space K2 after thecompletion of the exposure for the substrate P.

After the first liquid LQ1 on the substrate P and the second liquid LQ2on the upper surface T2 of the first optical element LS1 are recovered,the substrate stage PST, which supports the substrate P, is moved to anunload position by the control unit CONT to unload the substrate P.

The substrate P, which is next to be subjected to the exposure process,is loaded on the substrate stage PST. The control unit CONT supplies thesecond liquid LQ2 to the second space K2 in order to expose thesubstrate P loaded on the substrate stage PST. The substrate P isexposed in accordance with the same sequence as that described above.

This embodiment is constructed such that the second liquid LQ2 in thesecond space K2 is exchanged for every substrate P to be exposed.However, the second liquid LQ2 in the second space K2 may be exchangedat every predetermined time interval, every predetermined number ofsubstrates to be processed, or every lot, for example, provided that thedeterioration of the cleanness and the temperature change of the liquidLQ2 in the second space K2 are in such an extent that the exposureaccuracy is not affected thereby.

The supply and the recovery of the second liquid LQ2 may be performedcontinuously during the exposure of the substrate P or before or afterthe exposure as well. When the supply and the recovery of the secondliquid LQ2 are performed continuously, the second space K2 can be alwaysfilled with the temperature-managed and clean second liquid LQ2. On theother hand, when the exposure is performed in the state in which thesecond liquid LQ2 is pooled in the second space K2, and the secondliquid LQ2 is exchanged intermittently for the second space K2 as inthis embodiment, the vibration is not caused by the supply and therecovery of the second liquid LQ2 during the exposure of the substrate Pas described above. In the case of the procedure in which the supply andthe recovery of the second liquid LQ2 are continuously performed duringthe exposure of the substrate P, for example, if the supply amount andthe recovery amount of the second liquid LQ2 per unit time are unstable,the following possibility arises. That is, the second liquid immersionarea LR2 is enormously expanded, the second liquid LQ2 is subjected tothe outflow or the scattering at the inside of the barrel PK, and thedamage is increased. If the supply amount and the recovery amount of thesecond liquid LQ2 per unit time are unstable, any inconvenience arisessuch that the second liquid immersion area LR2 is exhausted, and theexposure accuracy is deteriorated. Therefore, when the second liquid LQ2is exchanged intermittently for the second space K2, then it is possibleto form the second liquid immersion area LR2 in a desired state, and itis possible to avoid the occurrence of the inconvenience as describedabove.

There is such a possibility that the first liquid LQ1 may be polluted bybeing contaminated, for example, with any impurity generated from thesubstrate P, including, for example, any foreign matter resulting, forexample, from the photosensitive agent (photoresist), mixing into thefirst liquid LQ1 of the first liquid immersion area LR1 (first spaceK1). There is such a possibility that the lower surface T1 of the firstoptical element LS1 may be polluted with the contaminated first liquidLQ1, because the first liquid LQ1 in the first liquid immersion area LR1also makes contact with the lower surface T1 of the first opticalelement LS1. Further, there is also such a possibility that any impurityfloating in the air may adhere to the lower surface T1 of the firstoptical element LS1 exposed on the image plane side of the projectionoptical system PL.

In this embodiment, the first optical element LS1 can be easily attachedand detached (exchangeable) with respect to the barrel PK. Therefore,the deterioration of the exposure accuracy and the measurement accuracyvia the projection optical system PL, which would be otherwise caused bythe pollution of the optical element, can be avoided by exchanging onlythe polluted first optical element LS1 with the clean first opticalelement LS1. On the other hand, the second liquid LQ2 in the secondspace K2 does not make any contact with the substrate P. Further, thesecond space K2 is the substantially closed space surrounded by thefirst optical element LS1, the second optical element LS2, and thebarrel PK. Therefore, the impurity floating in the air is hardly mixedinto the second liquid LQ2 in the second space K2, and the impurityhardly adheres to the lower surface T3 of the second optical element LS2and the upper surface T2 of the first optical element LS1. Therefore,the cleanness is maintained for the lower surface T3 of the secondoptical element LS2 and the upper surface T2 of the first opticalelement LS1. Therefore, when only the first optical element LS1 isexchanged, then it is possible to avoid, for example, the deteriorationof the transmittance of the projection optical system PL, and it ispossible maintain the exposure accuracy and the measurement accuracy.

An arrangement is also conceived, in which the liquid of the firstliquid immersion area LR1 is allowed to make contact with the secondoptical element LS2 without providing the first optical element LS1formed of the parallel flat plate. However, if it is intended toincrease the image side numerical aperture of the projection opticalsystem PL, then it is necessary to increase the effective diameter ofthe optical element, and it is inevitable that the optical element LS2has a large size. The nozzle member 70 as described above and thevarious types of the measuring units such as the alignment system(although not shown) are arranged around the optical element LS2.Therefore, if such a large-sized optical element LS2 is exchanged, thenthe operability is lowered, and the operation is difficult to beperformed. Further, the optical element LS2 has the refractive power(lens function). Therefore, it is necessary that the optical element LS2should be attached to the barrel PK with the high positioning accuracyin order to maintain the optical characteristic (image formationcharacteristic) of the entire projection optical system PL. Therefore,it is not preferable to frequently attach and detach (exchange) theoptical element LS2 as described above with respect to the barrel PK inview of the maintenance of the optical characteristic of the projectionoptical system PL (positioning accuracy of the optical element LS2) aswell. This embodiment is constructed such that the relativelysmall-sized parallel flat plate is provided as the first optical elementLS1, and the first optical element LS1 is exchanged. Therefore, theoperability is satisfactory, and the exchange operation can be performedwith ease. It is also possible to maintain the optical characteristic ofthe projection optical system PL. Further, the exposure apparatus EX isprovided with the first and second liquid immersion mechanisms 1, 2which are capable of independently supplying and recovering the firstand second liquid LQ1, LQ2 with respect to the first space K1 disposedon the side of the lower surface T1 of the first optical element LS1 andthe second space K2 disposed on the side of the upper surface T2 of thefirst optical element LS1 respectively. Accordingly, the exposure lightbeam EL, which is radiated from the illumination optical system IL, issuccessfully allowed to satisfactorily arrive at the substrate Parranged on the image plane side of the projection optical system PLwhile maintaining the cleanness of the first and second liquid LQ1, LQ2.

As explained above, the space between the substrate P and the lowersurface T1 of the first optical element LS1 is filled with the firstliquid LQ1, and the space between the second optical element LS2 and theupper surface T2 of the first optical element LS1 is filled with thesecond liquid LQ2. Accordingly, the exposure light beam EL, which haspassed through the mask M, can be allowed to satisfactorily arrive atthe substrate P, and the substrate P can be exposed satisfactorily. Thesecond liquid immersion area LR2 of the second liquid LQ2 is locallyformed on the side of the upper surface T2 of the first optical elementLS1. Therefore, it is possible to avoid the inconvenience which would beotherwise caused, for example, such that the second liquid LQ2 of thesecond liquid immersion area LR2 is polluted due to the contact of thesecond liquid LQ2, for example, with the barrel PK, and the barrel PKincluding the first support section 91 is deteriorated by the secondliquid LQ2. When the second liquid immersion area LR2 is formed locally,it is possible to avoid the inconvenience which would be otherwisecaused such that the second liquid LQ2 leaks to the outside of thebarrel PK. Therefore, when any seal mechanism is provided in order toavoid the leakage of the second liquid LQ2, the seal mechanism can beconstructed simply and conveniently. Alternatively, the seal mechanismmay be omitted.

The outer diameter D3 of the lower surface T3 of the second opticalelement LS2 opposed to the first optical element LS1 is smaller than theouter diameter D2 of the upper surface T2 of the first optical elementLS1. Therefore, the second liquid immersion area LR2, which has the sizecorresponding to the lower surface T3 of the second optical element LS2,can be formed locally and satisfactorily on the upper surface T2 of thefirst optical element LS1. It is possible to further reliably avoid theleakage of the second liquid LQ2 from the circumference of the uppersurface T2 of the first optical element LS1.

In the embodiment described above, the upper surface T2 of the firstoptical element LS1 is provided with the second area HR2 having theliquid repellence in order to avoid, for example, the leakage of thesecond liquid LQ2. However, as schematically shown in FIG. 10, a bankportion DR may be provided to surround the first area HR1 on the uppersurface T2 of the first optical element LS1. Also in this way, it ispossible to avoid the leakage of the second liquid LQ2 of the secondliquid immersion area LR2 formed in the first area HR1. In thisarrangement, the optical path for the exposure light beam EL in thesecond space K2 may be filled with the second liquid LQ2 by storing apredetermined amount of the second liquid LQ2 in the bank portion DR.The second liquid LQ2, which has overflowed from the bank portion DR orwhich is likely to overflow, may be recovered.

In the embodiment described above, the liquid recovery port is providedon the inclined surface of the lower surface of the nozzle member 70(lower surface of the porous member). However, when the leakage of theliquid LQ is successfully suppressed, the liquid recovery port may beprovided on the surface which is substantially parallel to (flush with)the land surface 75, without forming the inclined surface on the lowersurface of the nozzle member 70. That is, the first liquid recovery port22 may be provided as shown in FIGS. 9(a) and 9(b) provided that theliquid LQ1 can be recovered without causing any leakage even when themovement velocity of the substrate P is increased, for example, when thecontact angle of the liquid LQ1 with respect to the substrate P islarge, or when the ability to recover the liquid LQ1 from the firstrecovery port 22 by the first recovery mechanism 20 is excellent.

In the embodiment described above, the wall portion 76 is provided atthe circumferential edge of the inclined surface (lower surface of theporous member) formed on the lower surface of the nozzle member 70.However, when the leakage of the liquid LQ is successfully suppressed,it is also possible to omit the wall portion 76.

In the embodiment described above, the part of the land surface (flatportion) 75 of the nozzle member 70 is formed between the projectionoptical system PL and the substrate P, and the inclined surface (lowersurface of the porous member) is formed at the outside thereof. However,the part of the land surface may be arranged outside (around) the endsurface T1 of the projection optical system PL with respect to theoptical axis of the projection optical system PL, instead of beingarranged under the projection optical system PL. In this arrangement,the land surface 75 may be substantially flush with the end surface T1of the projection optical system PL. Alternatively, the position of theland surface 75 in the Z axis direction may be separated in the +Zdirection or in the −Z direction from the end surface T1 of theprojection optical system PL.

In the embodiment described above, the liquid supply port 12 is formedto be annular slit-shaped to surround the projection area AR1. However,a plurality of supply ports, which are separated from each other, may beprovided. In this arrangement, the positions of the supply ports are notspecifically limited. The supply ports may be provided one by one on theboth sides of the projection area AR1 (on the both sides in the X axisdirection or on the both sides in the Y axis direction). Alternatively,the supply ports may be provided one by one (four in total) on the bothsides of the projection area AR1 in the X axis direction and the Y axisdirection. It is also allowable that only one supply port may beprovided at a position separated in a predetermined direction withrespect to the projection area AR1 provided that the desired liquidimmersion area AR2 can be formed. In the embodiment described above, thefirst supply port 12 is provided at the position opposed to thesubstrate P. However, there is no limitation thereto. For example, thefirst liquid LQ1 may be supplied from the space between the firstoptical element LS1 and the bottom plate portion 72D. Also in thisarrangement, the supply port may be provided to surround the opticalpath for the exposure light beam FL. Alternatively, the supply ports maybe provided one by one on the both sides of the optical path for theexposure light beam EL. When the liquid LQ is supplied from a pluralityof supply ports, the amounts of the liquid LQ to be supplied from therespective supply ports may be adjustable so that the liquid may besupplied in different amounts from the respective supply ports.

As shown in FIG. 11, a plurality of fin members 150 may be formed on theinclined surface formed on the lower surface of the nozzle member 70(lower surface of the porous member 25). The fin member 150 issubstantially triangular as viewed in a side view. As shown in the sidesectional view in FIG. 11, the fin members 150 are arranged in thebuffer space formed on the inner side of the wall portion 76 and on thelower surface of the porous member 25. The fin member 150 is attached tothe inner side surface of the wall portion 76 radially so that thelongitudinal direction thereof is directed outwardly. In thisarrangement, the plurality of fin members 150 are separated from eachother, and the spaces are formed between the respective fin members 150.When the plurality of fin members 150 are arranged as described above,it is possible to increase the liquid contact area on the inclinedsurface (lower surface of the porous member 25) formed on the lowersurface of the nozzle member 70. Therefore, it is possible to improvethe performance to retain the liquid LQ on the lower surface of thenozzle member 70. The plurality of fin members 150 may be provided atequal intervals. Alternatively, the plurality of fin members 150 may beprovided at unequal intervals. For example, the intervals of the finmembers 150 arranged on the both sides in the X axis direction withrespect to the projection area AR1 may be set to be smaller than theintervals of the fin members 150 arranged on the both sides in the Yaxis direction with respect to the projection area AR1. It is preferablethat the surface of the fin member 150 is liquid-attractive with respectto the liquid LQ. The fin member 150 may be formed by applying the“GOLDEP” treatment or the “GOLDEP WHITE” treatment to stainless steel(for example, SUS 316). Alternatively, the fin member 150 can be formedof, for example, glass (silica glass) as well.

Next, another embodiment will be explained with reference to FIG. 12. Inthe following description, the same or equivalent constitutive portionsas those of the embodiment described above are designated by the samereference numerals, any explanation of which will be simplified oromitted.

Also in this embodiment, each of the first optical element LS1 and thesecond optical element LS2 is supported in the substantially stationarystate by the barrel PK with respect to the optical path for the exposurelight beam EL.

With reference to FIG. 12, the first optical element LS1 is a parallelflat plate in which the lower surface T1 and the upper surface T2 are inparallel to each other. The lower surface T1 and the upper surface T2are substantially parallel to the XY plane. The first optical elementLS1 is supported by a first support section 91 provided at the lower endof the barrel PK. A flange portion F1, which serves as a supportobjective portion, is provided at an upper portion of the first opticalelement LS1. The first support section 91 supports the first opticalelement LS1 by supporting the lower surface T5 of the flange portion F1.In this arrangement, the lower surface T5 of the flange portion F1 isalso substantially parallel to the XY plane, and the lower surface T5 ofthe flange portion F1 is formed around the lower surface T1 of the firstoptical element LS1.

The distance (thickness) H1 between the lower surface T1 and the uppersurface T2 of the first optical element LS1 on the optical axis AX ofthe projection optical system PL is not less than 15 mm. As alsoclarified from FIG. 12, the distance H1 between the lower surface T1 andthe upper surface T2 of the first optical element LS1 on the opticalaxis AX is greater than the distance between the substrate P and thelower surface T1 of the first optical element LS1. That is, thethickness of the first optical element LS1 on the optical axis AX isformed to be thicker than the liquid LQ1. Also in this embodiment, thethickness of the liquid LQ1 is about 3 mm. The distance between the landsurface 75 and the substrate P is about 1 mm. In this embodiment, thethickness H1 of the first optical element LS1 is about 15 mm. However,there is no limitation thereto. The thickness H1 can be set within arange of about 15 mm to 20 mm.

The second optical element LS2 is supported by a second support section92 which is provided over the first support section 91 in the barrel PK.A flange portion F2, which serves as a support objective portion, isprovided at an upper portion of the second optical element LS2. Thesecond support section 92 supports the second optical element LS2 bysupporting the flange portion F2. The lower surface T3 of the secondoptical element LS2 is formed to be flat or planar. The lower surface T3of the second optical element LS2 supported by the second supportsection 92 is substantially parallel to the upper surface T2 of thefirst optical element LS1 supported by the first support section 91. Onthe other hand, the upper surface T4 of the second optical element LS2is formed to be convex toward the object plane (toward the mask M), andhas a positive refractive power.

The first optical element LS1 can be easily attached and detached withrespect to the first support section 91 of the barrel PK. That is, thefirst optical element LS1 is provided exchangeably. The second opticalelement LS2, which has the refractive power (lens function), issupported by the second support section 92 of the barrel PK in a stateof being satisfactorily positioned.

The upper surface T2 of the first optical element LS1 having the flangeportion F1 is formed to be sufficiently greater than the lower surfaceT3 of the second optical element LS2. The outer diameter D3 of the lowersurface T3 of the second optical element LS2 opposed to the firstoptical element LS1 is smaller than the outer diameter D2 of the uppersurface T2 of the first optical element LS1. The second liquid immersionarea LR2 is locally formed by the second liquid LQ2 on the upper surfaceT2 of the first optical element LS1.

The distance H1 between the lower surface T1 and the upper surface T2 ofthe first optical element LS1 is longer than the distance H2 between theupper surface T2 of the first optical element LS1 and the lower surfaceT5 of the flange portion F1. In this embodiment, the outer diameter D2of the upper surface T2 of the first optical element LS1 having theflange portion F1 is set to be not less than twice the outer diameter D1of the lower surface T1 of the first optical element LS1. The firstoptical element LS1, which has the lower surface T5 of the flangeportion F1 supported by the first support section 91, has the lowerportion which is exposed (which protrudes) downwardly from the lowersurface PKA of the barrel PK.

At least a part of the nozzle member 70 is arranged in the space formedbetween the substrate P and the flange portion F1 of the first opticalelement LS1 and the first support section 91 for supporting the flangeportion F1. In other words, the flange portion (support objectiveportion) F1 of the first optical element LS1 and the first supportsection 91 for supporting the flange portion F1, are provided over(above) the nozzle member 70. The upper surface 703 of the nozzle member70 is opposed to the lower surface 15 of the flange portion F1 of thefirst optical element LS1 and the lower surface PKA of the barrel PK. Aninner side surface 70T of the nozzle member 70 is opposed to a sidesurface C1 of the first optical element LS1.

The nozzle member 70, which is arranged under the flange portion F1, isarranged closely to the side surface C1 of the first optical elementLS1. The first supply port 12, which is provided for the nozzle member70, is provided closely to the projection area AR. The first recoveryport 22, which is formed to surround the projection area AR, is alsoprovided closely to the projection area AR. The outer diameter D22 ofthe first recovery port 22 is provided to be smaller than the outerdiameter D2 of the upper surface T2 of the first optical element LS1.

The bottom plate portion 72D, which forms the land surface 75, isarranged to creep into the space under the lower surface T1 of the firstoptical element LS1.

As explained above, the outer diameter D2 of the upper surface T2 of thefirst optical element LS1 is greater than the outer diameter D1 of thelower surface T1. More specifically, the outer diameter D2 of the uppersurface T2 is not less than twice the outer diameter D1 of the lowersurface T1. Therefore, when the first optical element LS1 is supportedby the first support section 91, the first support section forsupporting the first optical element LS1 can be provided at the positionseparated far from the optical axis AX of the first optical element LS1in relation to the horizontal direction, by allowing the first supportsection 91 to support the end portion of the upper surface T2 (flangeportion F1). Therefore, it is possible to secure the space between thefirst support section 91 and the side surface C1 of the first opticalelement LS1 (space around the first optical element LS1). The nozzlemember 70, which is provided for the first liquid LQ1, can be arrangedin the space. This arrangement is not directed to only the nozzle member70. It is also possible to improve the degree of freedom of thearrangement, for example, when various measuring units such as thealignment system are arranged. It is also possible to improve the degreeof freedom of the design of the measuring unit or the like to bearranged in the space, because the space is sufficiently secured. Theouter diameter D2 of the upper surface T2 of the first optical elementLS1 is not less than twice the outer diameter D1 of the lower surfaceT1, and the outer diameter D1 of the lower surface T1 of the firstoptical element LS1 is sufficiently smaller than the upper surface T2.Therefore, the first liquid LQ1 of the first liquid immersion area LR1formed by the first liquid immersion mechanism 1 is made to have acontact with the lower surface T1, and thus the size of the first liquidimmersion area LR1 can be decreased depending on the lower surface T1.Therefore, it is possible to avoid the inconvenience of the enormousincrease in size of the entire exposure apparatus EX which would beotherwise caused by the enormous increase in size of the first liquidimmersion area LR1. The size (position) of the first recovery port 22 isregarded as one of the factors to determine the size of the first liquidimmersion area LR1. However, the outer diameter D22 of the firstrecovery port 22 is smaller than the outer diameter D2 of the uppersurface T2 of the first optical element LS1. Therefore, it is possibleto decrease the size of the first liquid immersion area LR1.

The distance H1 between the lower surface T1 and the upper surface T2 ofthe first optical element LS1 is greater than the distance between thefirst optical element LS1 and the substrate P. More specifically, thedistance H1 is not less than 15 mm, and the first optical element LS1 isthick. Accordingly, when the first optical element LS1 is supported bythe first support section 91, the first support section 91, whichsupports the first optical element LS1, can be provided at the positionseparated far from the lower surface T1 of the first optical element LS1in relation to the vertical direction, by allowing the first supportsection 91 to support the portion disposed in the vicinity of the uppersurface T2 of the first optical element LS1, i.e., the flange portion F1for forming the upper surface T2 in this embodiment. Therefore, it ispossible to secure the space between the substrate P and the lowersurface T5 of the flange portion F1 of the first optical element LS1(space around the first optical element LS1). The nozzle member 70 canbe arranged in the space. This arrangement is not directed to only thenozzle member 70. It is also possible to improve the degree of freedomof the arrangement, for example, when various measuring units such asthe alignment system are arranged. It is also possible to improve thedegree of freedom of the design. The nozzle member 70 can be arrangedclosely to the side surface C1 of the first optical element LS1.Accordingly, it is possible to realize the compact size of the nozzlemember 70, and it is possible to decrease the size of the first liquidimmersion area LR1 of the first liquid LQ1. Therefore, it is possible toavoid the inconvenience of the enormous increase in size of the entireexposure apparatus EX which would be otherwise caused by the enormousexpansion of the first liquid immersion area LR1.

The thickness (distance H1) of the first optical element LS1 is thickerthan that of the first liquid LQ1 disposed between the first opticalelement LS1 and the substrate P. More specifically, the distance H1 isnot less than 15 mm. Accordingly, it is possible to suppress the changeof the shape of the first optical element LS1 which would be otherwisecaused by the force received from the liquid. Therefore, it is possibleto maintain the high image formation performance of the projectionoptical system PL.

In the embodiment explained with reference to FIG. 12, the first opticalelement LS1 satisfies both of the condition in which the distance(thickness) H1 is not less than 15 mm and the condition in which theouter diameter D2 of the upper surface T2 is not less than twice theouter diameter D1 of the lower surface T1. However, the first opticalelement LS1 may be constructed under a condition in which any one of theforegoing conditions is satisfied. Even in the case of the arrangementin which any one of the conditions is satisfied, it is possible torealize the compact size of the nozzle member 70, and it is possible toavoid the enormous expansion of the first liquid immersion area LR1.

In the embodiment explained with reference to FIG. 12, the first opticalelement LS1 has the conical side surface in which the outer diameter isdecreased at positions separated farther from the flange portion F1toward the lower surface T1. However, the shape of the first opticalelement LS1 is not limited to this shape. For example, a columnar firstoptical element LS1 may also be adopted, in which the side surface hasthe outer diameter D1 while maintaining the flange portion F1. Inanother viewpoint, the diameter of the exposure light beam EL in thescanning direction (X direction) is smaller than the diameter in thenon-scanning direction (Y direction) in the first optical element LS1.Therefore, a first optical element may also be adopted, wherein thecross section, which is taken along the XY plane, is an ellipse having asmall diameter in the X direction, wherein the first optical element hasa side surface such that the outer diameter is decreased at positionsseparated farther from the flange portion F1 toward the lower surfaceT1. The shape and the arrangement of the nozzle member can be changed inconformity therewith.

Also in this embodiment, the distance between the substrate P and thelower surface T1 of the first optical element LS1 is about 3 mm, thedistance between the land surface 75 and the substrate P is about 1 mm,and the distance between the upper surface T2 of the first opticalelement LS1 and the lower surface T3 of the second optical element LS2is about 3 mm. However, the distance between the substrate P and thelower surface T1 of the first optical element LS1 can be set within arange of 1 to 5 mm, considering the absorption of the exposure lightbeam EL by the liquid LQ1 and the flow of the liquid LQ1 in the firstspace K1, in the same manner as in the embodiment described above. Thedistance between the land surface 75 and the substrate P can be also setwithin a range of 0.5 to 1 mm. The distance between the upper surface T2of the first optical element LS1 and the lower surface T3 of the secondoptical element LS2 can be also set within a range of 0.5 to 5 mmconsidering the flow of the liquid LQ2.

In this embodiment, the barrel PK is constructed by combining aplurality of divided barrels (sub-barrels). The sub-barrel, whichincludes the first support section 91 for supporting the first opticalelement LS1, can be attached and detached with respect to the partialbarrel for supporting the other optical elements L2 to L7. The firstoptical element LS1 having the flange portion F1 is exchangeable bybeing detached from the partial barrel together with the sub-barrel.

When the first optical element LS1 of the embodiment of the presentinvention is used, it is also allowable to adopt an arrangement in whichno second liquid immersion area LR2 is formed as shown in FIG. 13. Thefirst optical element LS1 shown in FIG. 13 is the optical element whichis closest to the image plane of the projection optical system PL. Theupper surface T2 of the first optical element LS1 is formed to be convextoward the object plane, which has a positive refractive index. Thefirst liquid LQ1 of the first liquid immersion area LR1 makes contactwith the first optical element LS1. In such a situation, when the firstoptical element LS1 satisfies at least any one of the condition in whichthe distance H1 between the lower surface T1 and the upper surface T2 onthe optical axis AX is not less than 15 mm and the condition in whichthe outer diameter D2 of the upper surface T2 is not less than twice theouter diameter D1 of the lower surface T1, then it is possible torealize the compact size of the nozzle member 70, and it is possible toavoid the enormous expansion of the first liquid immersion area LR1.

In the respective embodiments described above, the second liquidimmersion area LR2 of the second liquid LQ2 is locally formed on theupper surface T2 of the first optical element LS1. However, as shown inFIG. 14, an arrangement is also adoptable, in which the second liquidLQ2 of the second liquid immersion area LR2 is arranged in thesubstantially entire region of the upper surface T2.

Also in the embodiment shown in FIG. 14, the first optical element LS1satisfies at least any one of the condition in which the distance H1between the lower surface T1 and the upper surface T2 on the opticalaxis AX is not less than 15 mm and the condition in which the outerdiameter D2 of the upper surface T2 is not less than twice the outerdiameter D1 of the lower surface T1. In the same manner as theembodiment explained, for example, with reference to FIG. 12, the firstoptical element LS1 is exposed (allowed to protrude) downwardly from thebarrel PK, and the nozzle member 70 is arranged closely to the firstoptical element LS1.

A second supply port 32, which constructs a part of the second liquidsupply mechanism 30, is provided on the inner side surface PKC of thebarrel PK. The second supply port 32 is formed at the position in thevicinity of the second space K2 on the inner side surface PKC of thebarrel PK. The second supply port 32 is provided on the +X side withrespect to the optical axis AX of the projection optical system PL. Thesecond liquid LQ2, which is fed from the second liquid supply section31, is discharged by the second supply port 32 substantially in parallelto the upper surface T2 of the first optical element LS1, i.e.,substantially in parallel to the XY plane (in the lateral direction).The force, which is exerted by the supplied second liquid LQ2, forexample, on the first and second optical elements LS1, LS2, can bereduced, because the second supply port 32 discharges the second liquidLQ2 substantially in parallel to the upper surface T2 of the firstoptical element LS1. Therefore, it is possible to avoid the occurrenceof the inconvenience which would be otherwise caused, for example, suchthat the first and second optical elements LS1, LS2 or the like aredeformed or displaced due to the supplied second liquid LQ2.

A second recovery port 42, which constructs a part of the second liquidrecovery mechanism 40, is provided at a predetermined position withrespect to the second supply port 32 on the inner side surface PKC ofthe barrel PK. The second recovery port 42 is formed at the position inthe vicinity of the second space K2 on the inner side surface PKC of thebarrel PK. The second recovery port 42 is provided on the −X side withrespect to the optical axis AX of the projection optical system PL. Thatis, the second supply port 32 and the second recovery port 42 areopposed to each other. In this embodiment, the second supply port 32 andthe second recovery port 42 are formed to be slit-shaped respectively.The second supply port 32 and the second recovery port 42 may be formedto have arbitrary shapes including, for example, substantially circular,elliptical, and rectangular shapes. In this embodiment, the secondsupply port 32 and the second recovery port 42 mutually haveapproximately the same size. However, the second supply port 32 and thesecond recovery port 42 may have sizes different from each other.

The other end of the second supply tube 33 is connected to one end ofthe second supply flow passage 34 formed in the barrel PK. On the otherhand, the other end of the second supply flow passage 34 of the barrelPK is connected to the second supply port 32 formed on the inner sidesurface PKC of the barrel PK. The second liquid LQ2, which is fed fromthe second liquid supply section 31 of the second liquid supplymechanism 30, flows through the second supply tube 33, and then thesecond liquid LQ2 flows into one end of the second supply flow passage34 formed in the barrel PK. The second liquid LQ2, which has flown intoone end of the second supply flow passage 34, is supplied to the secondspace K2 between the second optical element LS2 and the first opticalelement LS1 from the second supply port 32 formed on the inner sidesurface PKC of the barrel PK.

The other end of the second recovery tube 43 is connected to one end ofthe second recovery flow passage 44 formed in the barrel PK. On theother hand, the other end of the second recovery flow passage 44 isconnected to the second recovery port 42 formed on the inner sidesurface PKC of the barrel PK. When the second liquid recovery section 41of the second liquid recovery mechanism 40 is driven, the second liquidLQ2 in the second space K2 flows into the second recovery flow passage44 via the second recovery port 42. After that, the second liquid LQ2 issucked and recovered by the second liquid recovery section 41 via thesecond recovery tube 43.

The barrel PK is provided with an opposing surface 93 which is opposedto the circumferential edge area of the upper surface T2 of the firstoptical element LS1 supported by the first support section 91. A firstseal member 94 is provided between the opposing surface 93 and thecircumferential edge area of the upper surface T2. The first seal member94 is formed of, for example, a C-ring or an O-ring (for example,“Kalrez” produced by DuPont Dow). The first seal member 94 avoids theleakage of the second liquid LQ2 arranged on the upper surface T2 to theoutside of the upper surface T2, and consequently the leakage to theoutside of the barrel PK. A second seal member 95 is provided betweenthe side surface C2 of the second optical element LS2 and the inner sidesurface PKC of the barrel PK. The second seal member 95 is formed of,for example, a V-ring. The second seal member 95 regulates the flow ofthe fluid (including the gas, the second liquid LQ2, and the humid gasgenerated from the second liquid LQ2) between the second space K2 and athird space K3 disposed upwardly from the second optical element LS2 inthe barrel PK. Accordingly, it is possible to maintain the environment(for example, the temperature and the humidity) in the internal space ofthe barrel PK including the third space K3. Further, it is possible toprevent the gas (bubble), from the third space K3, from entering intothe second liquid LQ2 of the second liquid immersion area LR2.

The distance between the side surface C2 of the second optical elementLS2 and the inner side surface PKC of the barrel PK may be narrowed, forexample, to about 1 to 5 μm without providing the second seal member 95.Also in this way, it is possible to prohibit the flow of the fluidbetween the second space K2 and the third space K3 via the gap betweenthe side surface C2 of the second optical element LS2 and the inner sidesurface PKC of the barrel PK.

When the substrate P is exposed, the control unit CONT supplies andrecovers the second liquid LQ2 by using the second liquid supplymechanism 30 and the second liquid recovery mechanism 40 while optimallycontrolling the supply amount of the second liquid LQ2 per unit timebrought about by the second liquid supply mechanism 30 and the recoveryamount of the second liquid LQ2 per unit time brought about by thesecond liquid recovery mechanism 40. And the control unit CONT fills atleast the optical path for the exposure light beam EL in the secondspace K2 with the second liquid LQ2. In this embodiment, the secondliquid supply mechanism 30 supplies the second liquid LQ2 to the secondspace K2 at a flow rate of 0.1 cc/min to 100 cc/min.

In this embodiment, the supply operation and the recovery operation forthe second liquid LQ2 are continuously performed by the second liquidsupply mechanism 30 and the second liquid recovery mechanism 40 duringthe exposure of the substrate P as well. Further, the supply operationand the recovery operation for the second liquid LQ2 are continuouslyperformed by the second liquid supply mechanism 30 and the second liquidrecovery mechanism 40 before and after the exposure of the substrate Pas well. When the supply and the recovery of the second liquid LQ2 arecontinuously performed by the second liquid supply mechanism 30 and thesecond liquid recovery mechanism 40, the second liquid LQ2 in the secondspace K2 is always exchanged with the clean and temperature-managedsecond liquid LQ2. The second space K2 is filled with the clean andtemperature-managed second liquid LQ2. When the supply operation and therecovery operation for the second liquid LQ2 are also continued withrespect to the second space K2 before and after the exposure of thesubstrate P, it is possible to avoid the occurrence of the inconveniencewhich would be otherwise caused, for example, such that any adhesiontrace (so-called water mark) is formed, for example, on the uppersurface T2 of the first optical element LS1 and the lower surface T3 ofthe second optical element LS2 resulting from the vaporization (drying)of the second liquid LQ2.

Also in the embodiment shown in FIG. 14, the supply and the recovery ofthe second liquid LQ2 by the second liquid immersion mechanism 2 may beperformed intermittently. For example, the supply operation and/or therecovery operation for the liquid by the second liquid immersionmechanism 2 may be stopped during the exposure of the substrate P.Accordingly, any vibration, which is to be caused by the supply and/orthe recovery of the second liquid LQ2, is not generated during theexposure of the substrate P. It is possible to avoid the deteriorationof the exposure accuracy which would be otherwise caused by thevibration.

Next, an explanation will be made about another embodiment of therecovery method with the first liquid recovery mechanism 20 in relationto the embodiments described above. In this embodiment, only the liquidLQ is recovered from the first recovery port 22. Accordingly, theoccurrence of vibration caused by the liquid recovery is suppressed.

The principle of the liquid recovery operation with the first liquidrecovery mechanism 20 of this embodiment will be explained below withreference to a schematic view shown in FIG. 16. For example, a thinplate-shaped mesh member, which is formed with a large number of pores,can be used as a porous member 25 for the first recovery port 22 of thefirst liquid recovery mechanism 20. In this embodiment, the porousmember (mesh member) is formed of titanium. In this embodiment, only theliquid LQ is recovered from the pores of the porous member 25 bycontrolling the pressure difference between the upper surface and thelower surface of the porous member 25 so that a predetermined conditionis satisfied as described later on, in a state in which the porousmember 25 is wet. The parameters concerning the predetermined conditioninclude, for example, the pore size of the porous member 25, the contactangle (affinity) of the porous member 25 with respect to the liquid LQ,and the suction force of the first liquid recovery section 21 (pressureat the upper surface of the porous member 25).

FIG. 16 shows a magnified view illustrating a partial cross section ofthe porous member 25, and depicts a specified example of the liquidrecovery to be performed by the aid of the porous member 25. Thesubstrate P is arranged under the porous member 25. The gas space andthe liquid space are formed between the porous member 25 and thesubstrate P. More specifically, the gas space is formed between thesubstrate P and the first pore 25Ha of the porous member 25, and theliquid space is formed between the substrate P and the second pore 25Hbof the porous member 25. Such a situation arises, for example, at theend of the liquid immersion area LR1 shown in FIG. 4, or such asituation arises by the generation of the gas in the liquid immersionarea LR1 due to any cause. A flow passage space, which forms a part ofthe first recovery flow passage 24, is formed over the porous member 25.

With reference to FIG. 16, when the following condition holds:

(4×γ×cos θ)/d≧(Pa−Pb)  (3)

wherein Pa represents the pressure of the space between the first pore25Ha of the porous member 25 and the substrate P (pressure at the lowersurface of the porous member 25), Pb represents the pressure of the flowpassage space over the porous member 25 (pressure at the upper surfaceof the porous member 25), d represents the pore size (diameter) of eachof the pores 25Ha, 25Hb, θ represents the contact angle of the porousmember 25 (inside of the pore 25H) with respect to the liquid LQ, and γrepresents the surface tension of the liquid LQ, then, as shown in FIG.16, even when the gas space is formed on the lower side of the firstpore 25Ha of the porous member 25 (on the side of the substrate P), thegas, which is disposed in the space on the lower side of the porousmember 25, can be prevented from any movement to (entering into) thespace disposed on the upper side of the porous member 25 via the pore25Ha. That is, the interface between the liquid LQ and the gas ismaintained in the pore 25Ha of the porous member 25 by optimizing thecontact angle θ, the pore size d, the surface tension γ of the liquidLQ, and the pressures Pa, Pb to satisfy the condition represented by theexpression (3). Thus, it is possible to suppress the inflow of the gasfrom the first pore 25Ha. On the other hand, the liquid space is formedon the lower side of the second pore 25Hb of the porous member 25 (onthe side of the substrate P). Therefore, it is possible to recover onlythe liquid LQ via the second pore 25Hb.

In the case of the condition represented by the expression (3) describedabove, the hydrostatic pressure of the liquid LQ on the porous member 25is not considered in order to simplify the explanation.

In this embodiment, the first liquid recovery mechanism 20 controls thesuction force of the first liquid recovery section 21 to adjust thepressure of the flow passage space over the porous member 25 so that theexpression (3) described above is satisfied, assuming that the pressurePa of the space under the porous member 25, the diameter d of the pore25H, the contact angle θ of the porous member 25 (inner side surface ofthe pore 25H) with respect to the liquid LQ, and the surface tension γof the liquid (pure water) LQ are constant. However, with reference tothe expression (3), as (Pa×Pb) is greater, i.e., as (4×γ×cos θ)/d isgreater, the pressure Pb is more easily controlled to satisfy theexpression (3). Therefore, it is desirable that the diameter d of thepore 25Ha, 25Hb and the contact angle θ of the porous member 25 withrespect to the liquid LQ (0°<θ<90°) are made as small as possible.

In the embodiments described above, the projection optical system PL isprovided with the element as the first optical element LS1 in which theouter diameter of the upper surface T2 is wider than that of the lowersurface T3 of the second optical element LS2. However, in order toachieve the formation of the liquid immersion area in only the partialarea of the upper surface (second surface) of the first optical element(first element) as in the first embodiment of the present invention, itis also allowable that the outer diameter of the lower surface 13 of thesecond optical element LS2 is wider than that of the upper surface T2 ofthe first optical element LS1. In this arrangement, for example, theouter edge portion of the lower surface T3 of the second optical elementLS2 can be treated to be liquid-repellent, and only the central portionfor forming the liquid immersion area can be treated to beliquid-attractive. Alternatively, a bank DR as shown in FIG. 10 may beprovided at the outer edge portion of the lower surface T3 of the secondoptical element LS2.

In the embodiments shown in FIGS. 1 to 14 and FIG. 16, it is notnecessarily indispensable that the supply operation and the recoveryoperation for the second liquid LQ2 performed by the second liquidsupply mechanism 30 and the second liquid recovery mechanism 40 are thesame as the supply operation and the recovery operation for the firstliquid LQ1 performed by the first liquid supply mechanism 10 and thefirst liquid recovery mechanism 20. It is also allowable that the supplyamount and the recovery amount of each of the liquids and/or the flowrate of each of the liquids is different from each other. For example,the supply amount and the recovery amount of the liquid LQ2 in thesecond space K2 may be smaller than the supply amount and the recoveryamount of the first liquid LQ1 in the first space, and the flow rate ofthe liquid LQ2 in the second space K2 may be slower than the flow rateof the liquid LQ1 in the first space K1.

In the embodiment described above, the liquid (pure water), which issupplied from the first liquid supply mechanism 10 to the first spaceK1, is the same as the liquid (pure water) which is supplied from thesecond liquid supply mechanism 30 to the second space K2 (temperature isthe same as well). However, even when the type of the liquid isidentical, the quality (for example, the temperature, the temperatureuniformity, and the temperature stability) may differ. For example, whenpure water is used as in the embodiment described above, the specificresistance value, the total organic carbon (TOC) value, and thedissolved gas concentration (dissolved oxygen concentration, dissolvednitrogen concentration), the refractive index, and the transmittance maydiffer, for example, in addition to the temperature, the temperatureuniformity, and the temperature stability.

As described above, pure water is used as the liquid LQ1, LQ2 in theembodiment of the present invention. Pure water is advantageous in thatpure water is available in a large amount with ease, for example, in thesemiconductor production factory, and pure water exerts no harmfulinfluence, for example, on the optical element (lens) and thephotoresist on the substrate P. Further, pure water exerts no harmfulinfluence on the environment, and the content of impurity is extremelylow. Therefore, it is also expected to obtain the function to wash(clean) the surface of the substrate P and the surface of the opticalelement provided at the end surface of the projection optical system PL.When the purity of pure water supplied from the factory or the like islow, the exposure apparatus may posses an ultrapure water-producingunit.

It is approved that the refractive index n of pure water (water) withrespect to the exposure light beam EL having a wavelength of about 193nm is approximately in an extent of 1.44. When the ArF excimer laserbeam (wavelength: 193 nm) is used as the light source of the exposurelight beam EL, then the wavelength is shortened on the substrate P by1/n, i.e., to about 134 nm, and a high resolution is obtained. Further,the depth of focus is magnified about n times, i.e., about 1.44 times ascompared with the value obtained in the air. Therefore, when it isenough to secure an approximately equivalent depth of focus as comparedwith the case of the use in the air, it is possible to further increasethe numerical aperture of the projection optical system PL. Also in thisviewpoint, the resolution is improved.

In the embodiment described above, the first and second liquid supplymechanisms 10, 30 supply pure water as the liquids LQ1, LQ2. However,mutually different types of liquids may be supplied so that the firstliquid LQ1, with which the first space K1 is filled, may be of the typedifferent from that of the second liquid LQ2 with which the second spaceK2 is filled. In this case, it is also allowable that the refractiveindex and/or the transmittance with respect to the exposure light beamEL differs between the first liquid and the second liquid. For example,the second space K2 may be filled with a predetermined liquid other thanpure water, which is represented by fluorine-based oil. The oil is sucha liquid that the probability of proliferation of microbes such asbacterial is low. Therefore, it is possible to maintain the cleanness ofthe second space K2 and the flow passage through which the second liquidLQ2 (fluorine-based oil) flows.

Both of the first and second liquids LQ1, LQ2 may be liquids other thanwater. For example, when the light source of the exposure light beam ELis the F₂ laser, the F₂ laser beam is not transmitted through water.Therefore, it is preferable to use a fluorine-based liquid including,for example, perfluoropolyether (PFPE) and fluorine-based oil throughwhich the F₂ laser beam is transmissive, as the first and second liquidLQ1, LQ2. In this case, the portion, which makes contact with the firstand second liquid LQ1, LQ2, is subjected to the liquid-attractingtreatment, for example, by forming a thin film with a substance having amolecular structure with small polarity including fluorine.Alternatively, other than the above, it is also possible to use, as thefirst and second liquid LQ1, LQ2, liquids (for example, cedar oil) whichhave the transmittance with respect to the exposure light beam EL, whichhave the refractive index as high as possible, and which are stableagainst the photoresist coated on the surface of the substrate P and theprojection optical system PL. Also in this case, the surface treatmentis performed depending on the polarity of the first and second liquidLQ1, LQ2 to be used. It is also possible to use various types of fluidshaving desired refractive indexes, including, for example, supercriticalfluids and gases having high refractive indexes, in place of pure waterfor the liquids LQ1, LQ2.

In the embodiment described above, the projection optical system PL,which includes the first optical element LS1 as the parallel flat platehaving no refractive power, is adjusted to have the predetermined imageformation characteristic. However, when the first optical element LS1exerts no influence on the image formation characteristic at all, it isalso allowable to make the adjustment so that the image formationcharacteristic of the projection optical system PL is the predeterminedimage formation characteristic except for the first optical element LS1.

In the embodiment described above, both of the first optical element LS1and the second optical element LS2 are supported by the barrel PK.However, the first optical element LS1 and the second optical elementLS2 may be supported by different support members respectively.

In the embodiment described above, both of the first optical element LS1and the second optical element LS2 are supported by the barrel PK in thesubstantially stationary state. However, the first optical element LS1and the second optical element LS2 may be supported finely movably inorder to adjust the position and the posture of at least one of thefirst optical element LS1 and the second optical element LS2.

In the embodiment described above, the first optical element LS1 is theparallel flat plate having no refractive power in which the lowersurface T1 and the upper surface T2 are the flat surfaces respectively,and the lower surface T1 and the upper surface T2 are in parallel toeach other. However, for example, the upper surface T2 of the firstoptical element LS1 may have a slight curvature. That is, the firstoptical element LS1 may be an optical element having any lens function.In this case, it is preferable that the curvature of the upper surfaceT2 of the first optical element LS1 is smaller than the curvatures ofthe upper surface T4 and the lower surface T3 of the second opticalelement LS2.

In the embodiment described above, it is also allowable that the secondliquid immersion mechanism 2 for performing the supply and the recoveryof the second liquid LQ2 is absent. In this case, the exposure isperformed without exchanging the second liquid LQ2 in the second spaceK2 in the state in which the space between the first optical element LS1and the second optical element LS2 is filled with the second liquid LQ2.In such a situation, there is such a possibility that the temperature ofthe second liquid LQ2 in the second liquid immersion area LR2 may bevaried by the radiation of the exposure light beam EL. Therefore, atemperature-adjusting unit, which adjusts the temperature of the secondliquid LQ2 in the second liquid immersion area LR2, may be provided, forexample, between the first optical element LS1 and the second opticalelement LS2 to successfully adjust the temperature of the second liquidLQ2 by using the temperature-adjusting unit. The respective embodimentsdescribed above are principally illustrative of the case in which theprojection optical system PL and the substrate P are opposed to oneanother. However, even when the projection optical system PL is opposedto another member (for example, the upper surface 91 of the substratestage PST), the space between the projection optical system PL and theanother member can be filled with the first liquid LQ1. In thisarrangement, the space on the image plane side of the projection opticalsystem PL may be continuously filled with the first liquid LQ1 by usingthe another member when the substrate stage PST is separated from theprojection optical system PL, for example, during the operation forexchanging the substrate.

In the case of the liquid immersion method as described above, thenumerical aperture NA of the projection optical system is 0.9 to 1.3 insome cases. When the numerical aperture NA of the projection opticalsystem is large as described above, it is desirable to use the polarizedillumination, because the image formation performance is deteriorateddue to the polarization effect in some cases with the random polarizedlight which has been hitherto used as the exposure light beam. In thiscase, it is appropriate that the linear polarized illumination, which isadjusted to the longitudinal direction of the line pattern of theline-and-space pattern of the mask (reticle), is effected so that thediffracted light of the S-polarized light component (TE-polarized lightcomponent), i.e., the component in the polarization direction along withthe longitudinal direction of the line pattern is dominantly allowed tooutgo from the pattern of the mask (reticle). When the space between theprojection optical system PL and the resist coated on the surface of thesubstrate P is filled with the liquid, the diffracted light of theS-polarized light component (TE-polarized light component), whichcontributes to the improvement in the contrast, has the hightransmittance on the resist surface, as compared with the case in whichthe space between the projection optical system PL and the resist coatedon the surface of the substrate P is filled with the air (gas).Therefore, it is possible to obtain the high image formation performanceeven when the numerical aperture NA of the projection optical systemexceeds 1.0. Further, it is more effective to appropriately combine, forexample, the phase shift mask and the oblique incidence illuminationmethod (especially the dipole illumination method) adjusted to thelongitudinal direction of the line pattern as disclosed in JapanesePatent Application Laid-open No. 6-188169. In particular, thecombination of the linear polarized illumination method and the dipoleillumination method is effective when the direction of the cycle of theline-and-space pattern is limited to a predetermined certain directionand/or when the hole pattern is clustered in a predetermined certaindirection. For example, when a phase shift mask of the half tone typehaving a transmittance of 6% (pattern of a half pitch of about 45 nm) isilluminated by using the linear polarized illumination method and thedipole illumination method in combination, the depth of focus (DOF) canbe increased by about 150 nm as compared with a case in which the randompolarized light beam is used, provided that the illumination σ, which isdefined by the circumscribed circle of the two light fluxes for formingthe dipole at the pupil plane of the illumination system, is 0.95, theradius of each light flux at the pupil plane is 0.125σ, and thenumerical aperture of the projection optical system PL is NA=1.2.

For example, when the ArF excimer laser is used as the exposure lightbeam, and the substrate P is exposed with a fine line-and-space pattern(for example, line-and-space of about 25 to 50 nm) by using theprojection optical system PL having a reduction magnification of about¼, then the mask M acts as a polarizing plate due to the Wave guideeffect depending on the structure of the mask M (for example, thepattern fineness and the thickness of chromium), and the diffractedlight of the S-polarized light component (TE-polarized light component)outgoes from the mask M in an amount greater than that of the diffractedlight of the P-polarized light component (TM-polarized light component)which lowers the contrast. In this case, it is desirable to use thelinear polarized illumination as described above. However, even when themask M is illuminated with the random polarized light, it is possible toobtain the high resolution performance even when the numerical apertureNA of the projection optical system PL is large, for example, 0.9 to1.3.

When the substrate P is exposed with an extremely fine line-and-spacepattern on the mask M, there is such a possibility that the P-polarizedlight component (TM-polarized light component) is greater than theS-polarized light component (TE-polarized light component) due to theWire Grid effect. However, for example, when the ArF excimer laser isused as the exposure light beam, and the substrate P is exposed with aline-and-space pattern greater than 25 nm by using the projectionoptical system PL having a reduction magnification of about ¼, then thediffracted light of the S-polarized light component (TE-polarized lightcomponent) outgoes from the mask M in an amount greater than that of thediffracted light of the P-polarized light component (TM-polarized lightcomponent). Therefore, it is possible to obtain the high resolutionperformance even when the numerical aperture NA of the projectionoptical system PL is large, for example, 0.9 to 1.3.

Further, it is also effective to use the combination of the obliqueincidence illumination method and the polarized illumination method inwhich the linear polarization is effected in the tangential(circumferential) direction of the circle having the center of theoptical axis as disclosed in Japanese Patent Application Laid-open No.6-53120, without being limited only to the linear polarized illumination(S-polarized illumination) adjusted to the longitudinal direction of theline pattern of the mask (reticle). In particular, when the pattern ofthe mask (reticle) includes not only the line pattern extending in onepredetermined direction, but the pattern also includes the line patternsextending in a plurality of different directions in a mixed manner(line-and-space patterns having different directions of the cycle arepresent in a mixed manner), then it is possible to obtain the high imageformation performance even when the numerical aperture NA of theprojection optical system is large, by using, in combination, the zonalillumination method and the polarized illumination method in which thelight is linearly polarized in the tangential direction of the circlehaving the center of the optical axis, as disclosed in Japanese PatentApplication Laid-open No. 6-53120 as well. For example, when a phaseshift mask of the half tone type having a transmittance of 6% (patternof a half pitch of about 63 nm) is illuminated by using, in combination,the zonal illumination method (zonal ratio: 3/4) and the polarizedillumination method in which the light is linearly polarized in thetangential direction of the circle having the center of the opticalaxis, the depth of focus (DOE) can be increased by about 250 nm ascompared with a case in which the random polarized light beam is used,provided that the illumination σ is 0.95, and the numerical aperture ofthe projection optical system PL is NA=1.00. In the case of a patternhaving a half pitch of about 55 nm with a numerical aperture NA=1.2 ofthe projection optical system, the depth of focus can be increased byabout 100 nm.

The substrate P, which is usable in the respective embodiments describedabove, is not limited to the semiconductor wafer for producing thesemiconductor device. Substrates applicable include, for example, theglass substrate for the display device, the ceramic wafer for the thinfilm magnetic head, and the master plate (synthetic silica glass,silicon wafer) for the mask or the reticle to be used for the exposureapparatus. In the embodiments described above, the light-transmissivetype mask (reticle), in which the predetermined shielding pattern (orthe phase pattern or the dimming pattern) is formed on thelight-transmissive substrate, is used. However, in place of the reticle,it is also allowable to use an electronic mask for forming atransmissive pattern, a reflective pattern, or a light emission patternon the basis of the electronic data of the pattern to be subjected tothe exposure, as disclosed, for example, in U.S. Pat. No. 6,778,257. Thepresent invention is also applicable to an exposure apparatus(lithography system) in which a line-and-space pattern is formed on awafer W by forming interference fringes on the wafer W, as disclosed inthe pamphlet of International Publication No. 2001/035168.

As for the exposure apparatus EX, the present invention is alsoapplicable to the scanning type exposure apparatus (scanning stepper)based on the step-and-scan system for performing the scanning exposurefor the pattern of the mask M by synchronously moving the mask M and thesubstrate P as well as the projection exposure apparatus (stepper) basedon the step-and-repeat system for performing the full field exposurewith the pattern of the mask M in a state in which the mask M and thesubstrate P are allowed to stand still, while successively step-movingthe substrate P.

As for the exposure apparatus EX, the present invention is alsoapplicable to the exposure apparatus of the system in which thesubstrate P is subjected to the full field exposure by using aprojection optical system (for example, a dioptric type projectionoptical system including no catoptric element with a reductionmagnification of ⅛) with a reduction image of a first pattern in a statein which the first pattern and the substrate P are allowed tosubstantially stand still. In this case, the present invention is alsoapplicable to the full field exposure apparatus based on the stitchsystem in which, subsequent to the exposure operation for the firstpattern as described above, the substrate P is subjected to the fullfield exposure while partially overlaying a reduction image of a secondpattern on the first pattern by using the projection optical system in astate in which the second pattern and the substrate P are allowed tosubstantially stand still thereafter. As for the exposure apparatusbased on the stitch system, the present invention is also applicable tothe exposure apparatus based on the step-and-stitch system in which atleast two patterns are partially overlaid and transferred on thesubstrate P, and the substrate P is successively moved. The presentinvention is also applicable to an exposure apparatus provided with ameasuring stage which includes members and sensors for the measurementseparately from the stage which holds the substrate P. The exposureapparatus provided with the measuring stage is described, for example,in European Patent Publication No. 1,041,357, contents of which areincorporated herein by reference within a range of permission of thedomestic laws and ordinances of the state designated or selected in thisinternational application.

The present invention is also applicable to the twin-stage type exposureapparatus. The structure and the exposure operation of the twin-stagetype exposure apparatus are disclosed, for example, in Japanese PatentApplication Laid-open Nos. 10-163099 and 10-214783 (corresponding toU.S. Pat. Nos. 6,341,007, 6,400,441, 6,549,269, and 6,590,634),Published Japanese Translation of PCT International Publication forPatent Application No. 2000-505958 (corresponding to U.S. Pat. No.5,969,441), and U.S. Pat. No. 6,208,407, contents of which areincorporated herein by reference within a range of permission of thedomestic laws and ordinances of the state designated or selected in thisinternational application.

In the embodiment described above, the exposure apparatus, in which thespace between the projection optical system PL and the substrate P islocally filled with the liquid, is adopted. However, the presentinvention is also applicable to the liquid immersion exposure apparatusin which the entire surface of the substrate as the exposure objectiveis covered with the liquid. The structure and the exposure operation ofthe liquid immersion exposure apparatus in which the entire surface ofthe substrate as the exposure objective is covered with the liquid aredescribed in detail, for example, in Japanese Patent ApplicationLaid-open Nos. 6-124873 and 10-303114 and U.S. Pat. No. 5,825,043,contents of which are incorporated herein by reference within a range ofpermission of the domestic laws and ordinances of the state designatedor selected in this international application.

As for the type of the exposure apparatus EX, the present invention isnot limited to the exposure apparatus for the semiconductor deviceproduction for exposing the substrate P with the semiconductor devicepattern. The present invention is also widely applicable, for example,to the exposure apparatus for producing the liquid crystal displaydevice or for producing the display as well as the exposure apparatusfor producing, for example, the thin film magnetic head, the imagepickup device (COD), the reticle, or the mask.

When the linear motor is used for the substrate stage PST and/or themask stage MST, it is allowable to use any one of those of the airfloating type based on the use of the air bearing and those of themagnetic floating type based on the use of the Lorentz's force or thereactance force. Each of the stages PST, MST may be either of the typein which the movement is effected along the guide or of the guidelesstype in which no guide is provided. An example of the use of the linearmotor for the stage is disclosed in U.S. Pat. Nos. 5,623,853 and5,528,118, contents of which are incorporated herein by referencerespectively within a range of permission of the domestic laws andordinances of the state designated or selected in this internationalapplication.

As for the driving mechanism for each of the stages PST, MST, it is alsoallowable to use a plane motor in which a magnet unit provided withtwo-dimensionally arranged magnets and an armature unit provided withtwo-dimensionally arranged coils are opposed to one another, and each ofthe stages PST, MST is driven by the electromagnetic force. In thisarrangement, any one of the magnet unit and the armature unit isconnected to the stage PST, MST, and the other of the magnet unit andthe armature unit is provided on the side of the movable surface of thestage PST, MST.

The reaction force, which is generated in accordance with the movementof the substrate stage PST, may be mechanically released to the floor(ground) by using a frame member so that the reaction force is nottransmitted to the projection optical system PL. The method for handlingthe reaction force is disclosed in detail, for example, in U.S. Pat. No.5,528,118 (Japanese Patent Application Laid-open No. 8-166475), contentsof which are incorporated herein by reference within a range ofpermission of the domestic laws and ordinances of the state designatedor selected in this international application.

The reaction force, which is generated in accordance with the movementof the mask stage MST, may be mechanically released to the floor(ground) by using a frame member so that the reaction force is nottransmitted to the projection optical system PL. The method for handlingthe reaction force is disclosed in detail, for example, in U.S. Pat. No.5,874,820 (Japanese Patent Application Laid-open No. 8-330224), contentsof which are incorporated herein by reference within a range ofpermission of the domestic laws and ordinances of the state designatedor selected in this international application.

As described above, the exposure apparatus EX according to theembodiment of the present invention is produced by assembling thevarious subsystems including the respective constitutive elements asdefined in claims so that the predetermined mechanical accuracy, theelectric accuracy, and the optical accuracy are maintained. In order tosecure the various accuracies, those performed before and after theassembling include the adjustment for achieving the optical accuracy forthe various optical systems, the adjustment for achieving the mechanicalaccuracy for the various mechanical systems, and the adjustment forachieving the electric accuracy for the various electric systems. Thesteps of assembling the various subsystems into the exposure apparatusinclude, for example, the mechanical connection, the wiring connectionof the electric circuits, and the piping connection of the air pressurecircuits in correlation with the various subsystems. It goes withoutsaying that the steps of assembling the respective individual subsystemsare performed before performing the steps of assembling the varioussubsystems into the exposure apparatus. When the steps of assembling thevarious subsystems into the exposure apparatus are completed, theoverall adjustment is performed to secure the various accuracies as theentire exposure apparatus. It is desirable that the exposure apparatusis produced in a clean room in which, for example, the temperature andthe cleanness are managed.

As shown in FIG. 15, the microdevice such as the semiconductor device isproduced by performing, for example, a step 201 of designing thefunction and the performance of the microdevice, a step 202 ofmanufacturing a mask (reticle) based on the designing step, a step 203of producing a substrate as a base material for the device, an exposureprocess step 204 of exposing the substrate with a pattern of the mask byusing the exposure apparatus EX of the embodiment described above, astep 205 of assembling the device (including a dicing step, a bondingstep, and a packaging step), and an inspection step 206.

INDUSTRIAL APPLICABILITY

According to the present invention, it is possible to avoid thedeterioration of the exposure accuracy and the measurement accuracywhich would be otherwise caused by the pollution of the element (opticalelement). Therefore, the exposure process and the measurement processcan be performed accurately. Further, according to the presentinvention, it is possible to realize the compact size of the apparatusitself, because the liquid immersion area can be made small.

1. A projection system used in a liquid immersion exposure apparatus inwhich a liquid immersion area is formed on a portion of an upper surfaceof a substrate by using a nozzle member having a recovery port and anopening via which an exposure beam passes, the projection systemcomprising: a first optical element closest to an image surface; and asecond optical element which is second closest to the image surface,wherein: the first optical element has (i) a first surface facing theimage surface, (ii) a second surface facing a lower surface of thesecond optical element, (iii) an inclined outer surface extendingupwardly and radially outwardly from the first surface and facing aninner surface of the nozzle member, and (iv) a flange portion providedabove the inclined outer surface, the flange portion being made of anoptical material of the first optical element, a distance between thefirst surface and the second surface on an axis which is substantiallyperpendicular to the first surface and which intersects the firstsurface is not less than 15 mm; and the flange portion of the firstoptical element is supported by a support member.
 2. The projectionsystem according to claim 1, wherein the axis is an optical axis of thefirst optical element.
 3. The projection system according to claim 1,wherein an outer size of the second surface in a direction substantiallyperpendicular to the axis is not less than twice an outer size of thefirst surface in the direction.
 4. A projection system for a liquidimmersion exposure apparatus in which a liquid immersion area is formedon a portion of an upper surface of a substrate by using a nozzle memberhaving a recovery port and an opening via which an exposure beam passes,the projection system comprising: a first optical element closest to animage surface; and a second optical element which is second closest tothe image surface, wherein: the first optical element has (i) a firstsurface facing the image surface, (ii) a second surface facing a lowersurface of the second optical element, (iii) an inclined outer surfaceextending upwardly and radially outwardly from the first surface andfacing an inner surface of the nozzle member, and (iv) a flange portionprovided above the inclined outer surface, the flange portion being madeof an optical material of the first optical element, an outer size ofthe second surface in a direction substantially perpendicular to anoptical axis of the first optical element is not less than twice anouter size of the first surface in the direction; and the flange portionof the first optical element is supported by a support member.
 5. Theprojection system according to claim 1, wherein the optical material ofthe first optical element is calcium fluorite or silica glass.
 6. Theprojection system according to claim 1, wherein the second opticalelement is a plano-convex lens having a convex upper surface.
 7. Theprojection system according to claim 1, wherein the flange portion has alower surface facing downwardly, and the lower surface of the flangeportion is parallel to the first surface.
 8. The projection systemaccording to claim 1, wherein the flange portion has a lower surfacefacing downwardly, and the lower surface of the flange portion issupported by the support member.
 9. The projection system according toclaim 1, wherein the flange portion has a lower surface facingdownwardly, and the lower surface of the flange portion is disposedopposite to an upper surface of the nozzle member.
 10. The projectionsystem according to claim 1, wherein the distance between the firstsurface and the second surface on the axis is larger than a distancebetween the first surface and the image surface on the axis.
 11. Theprojection system according to claim 1, wherein the second opticalelement is supported by the support member.
 12. The projection systemaccording to claim 11, wherein the second optical member has a flangeportion which is supported by the support member.
 13. An exposureapparatus comprising: a nozzle member having a recovery port and anopening via which an exposure beam passes; a support member; theprojection system according to claim 1 disposed with the inclined outersurface of the first optical element facing an inner surface of thenozzle member and the flange portion of the first optical elementsupported by the support member; and a substrate stage which has aholder for holding a substrate to be exposed and which moves thesubstrate below and relative to the nozzle member and the projectionsystem, wherein the substrate held on the holder is exposed byprojecting the exposure beam onto the substrate via the opening of thenozzle member through an immersion liquid between the first surface ofthe first optical element and the substrate.
 14. A device manufacturingmethod comprising: exposing a substrate using the exposure apparatusaccording to claim 13, and processing the exposed substrate.
 15. Aliquid immersion exposure method in which a substrate is exposed by anexposure beam through an immersion liquid between the substrate and anozzle member having a recovery port and an opening via which theexposure beam passes, the method comprising: projecting the exposurebeam through the projection system of claim 1; supporting the flangeportion of the first optical element by a support member; and holdingthe substrate to be exposed by a holder of a substrate stage which movesthe substrate below and relative to the nozzle member and the projectionsystem, wherein the substrate held on the holder is exposed byprojecting the exposure beam onto the substrate via the opening of thenozzle member through the immersion liquid between the first surface ofthe first optical element and the substrate.
 16. The projection systemaccording to claim 4, wherein the optical material of the first opticalelement is calcium fluorite or silica glass.
 17. The projection systemaccording to claim 4, wherein the second optical element is aplano-convex lens having a convex upper surface.
 18. The projectionsystem according to claim 4, wherein the flange portion has a lowersurface facing downwardly, and the lower surface of the flange portionis parallel to the first surface.
 19. The projection system according toclaim 4, wherein the flange portion has a lower surface facingdownwardly, and the lower surface of the flange portion is supported bythe support member.
 20. The projection system according to claim 4,wherein the flange portion has a lower surface facing downwardly, andthe lower surface of the flange portion is disposed opposite to an uppersurface of the nozzle member.
 21. The projection system according toclaim 4, wherein a distance between the first surface and the secondsurface on the optical axis is larger than a distance between the firstsurface and the image surface on the optical axis.
 22. The projectionsystem according to claim 4, wherein the second optical element issupported by the support member.
 23. The projection system according toclaim 22, wherein the second optical member has a flange portion whichis supported by the support member.
 24. An exposure apparatuscomprising: a nozzle member having a recovery port and an opening viawhich an exposure beam passes; a support member; the projection systemaccording to claim 4 disposed with the inclined outer surface of thefirst optical element facing an inner surface of the nozzle member andthe flange portion of the first optical element supported by the supportmember; and a substrate stage which has a holder for holding a substrateto be exposed and which moves the substrate below and relative to thenozzle member and the projection system, wherein the substrate held onthe holder is exposed by projecting the exposure beam onto the substratevia the opening of the nozzle member through an immersion liquid betweenthe first surface of the first optical element and the substrate.
 25. Adevice manufacturing method comprising: exposing a substrate using theexposure apparatus according to claim 24, and processing the exposedsubstrate.
 26. A liquid immersion exposure method in which a substrateis exposed by an exposure beam through an immersion liquid between thesubstrate and a nozzle member having a recovery port and an opening viawhich the exposure beam passes, the method comprising: projecting theexposure beam through the projection system of claim 4; supporting theflange portion of the first optical element by a support member; andholding the substrate to be exposed by a holder of a substrate stagewhich moves the substrate below and relative to the nozzle member andthe projection system, wherein the substrate held on the holder isexposed by projecting the exposure beam onto the substrate via theopening of the nozzle member through the immersion liquid between thefirst surface of the first optical element and the substrate.
 27. Aprojection system used in a liquid immersion exposure apparatus in whicha liquid immersion area is formed on a portion of an upper surface of asubstrate by using a nozzle member having a recovery port and an openingvia which an exposure beam passes, the projection system comprising: afirst optical element closest to an image surface; and a second opticalelement which is second closest to the image surface, wherein: the firstoptical element has (i) a first surface facing the image surface, (ii) asecond surface facing a lower surface of the second optical element,(iii) an inclined outer surface extending upwardly and radiallyoutwardly from the first surface and facing an inner surface of thenozzle member, and (iv) a projection provided above the inclined outersurface, the projection being made of an optical material of the firstoptical element, a distance between the first surface and the secondsurface on an axis which is substantially perpendicular to the firstsurface and which intersects the first surface is not less than 15 mm;and the projection of the first optical element is supported by asupport member.
 28. The projection system according to claim 27, whereinthe axis is an optical axis of the first optical element.
 29. Theprojection system according to claim 27, wherein an outer size of thesecond surface in a direction substantially perpendicular to the axis isnot less than twice an outer size of the first surface in the direction.